Delidded Core i9-7920X

[kachel94]

Looks like Der8auer is at it again tearing apart massive CPUs.

Weirdly enough the CPU looks glued to another PCB, this design suspiciously looks like some form of Xeon has been glued to an enthusiast grade 2066 socket. Who else thinks this?

The Core i9-7920X is the first photo in the series. The die rests on an interposer (the topmost PCB), which Intel connects to another underlying PCB. That layered design makes delidding Skylake-X chips more difficult than delidding a "regular" chip. Typically, you can use a simple razor blade to pop off the IHS (Integrated Heat Spreader), thus exposing the die. However, the stacked interposer introduces another layer of glue to the design, so you have to use a dedicated delidding tool.

 

My suspicion is there's possibly a BGA style interconnect between the layers.

 

Source: http://www.tomshardware.com/news/intel-i9-7920x-delid-die-skylake-x,35406.html

[Damascus]

Dear lord that is the most hilarious thing I've ever seen.  

[RadiatingLight]

15 minutes ago, kachel94 said:

design suspiciously looks like some form of Xeon has been glued to an enthusiast grade 2066 socket. Who else thinks this?

I would... but the Xeon socket is bigger than 2066.

I wonder if the Xeons will have this same dual-PCB design, and if it can be proven that they are the exact same chip, by swapping the top-layer PCB between the two. that would be awesome.

[MadOverclocker]

Is this a joke??? It seems intel ran out of ideas. It's like getting a socketed pcb then getting the actual CPU pcb and glueing them together. Wow, intel did done mega stupid job here...

[DocSwag]

13 minutes ago, Damascus said:

Dear lord that is the most hilarious thing I've ever seen.  

 

7 minutes ago, MadOverclocker said:

Is this a joke??? It seems intel ran out of ideas. It's like getting a socketed pcb then getting the actual CPU pcb and glueing them together. Wow, intel did done mega stupid job here...

They did the same thing with all the other skylake x CPUs, you know....

[MadOverclocker]

Just now, DocSwag said:

 

They did the same thing with all the other skylake x CPUs, you know....

Oh dear lord...

[Ginger_]

So... Intel calls AMD's cpus "glued together", then they go and glue their mainstream cpus ontop of a bigger pcb, with a larger heatspreader, and call it "extreme edition" with a higher price tag for everything to do with it?

 

This is something I would expect to see on a Saturday night live skit lmao

[MageTank]

17 minutes ago, RadiatingLight said:

I would... but the Xeon socket is bigger than 2066.

I wonder if the Xeons will have this same dual-PCB design, and if it can be proven that they are the exact same chip, by swapping the top-layer PCB between the two. that would be awesome.

Not quite. There are Xeon's on socket 2066. Xeon-W is basically every X299 SKU you've seen thus far, with overclocking turned off. The LGA3647 Xeon's will also have quad core variants, which should look extremely silly once delidded (if they are not soldered like the larger 3647 Xeon's).

 

What surprises me, is how everyone here is ignoring the fact that Broadwell-E had this exact same layered substrate. Why are we pretending this is something entirely new? Even the article fails to mention that fact. Here we have the 6950X (top) and 5960X (bottom):

[leadeater]

14 minutes ago, MageTank said:

What surprises me, is how everyone here is ignoring the fact that Broadwell-E had this exact same layered substrate. Why are we pretending this is something entirely new?

Sorry I can't hear you over my ignorance.

 

[SpaceGhostC2C]

17 minutes ago, MageTank said:

What surprises me, is how everyone here is ignoring the fact that Broadwell-E had this exact same layered substrate. Why are we pretending this is something entirely new? Even the article fails to mention that fact. Here we have the 6950X (top) and 5960X (bottom):

That kind of confirms the simplest explanation, namely

Quote

The interposer allows Intel to mix and match different die into the same socket. 

although I was hoping for something more intriguing  

 

Also, this passage drew my attention:

Quote

Intel also released new microcode for its Skylake-X processors recently, which reduces performance in some titles and lowers the AVX offset by two bins, which is likely designed to address the recent thermal issues.

but the link provided is broken (it goes to Threadripper's review instead of a news article on Intel's microcode ), so I don't know what's the deal.

[mr moose]

1 hour ago, MageTank said:

ses me, is how everyone here is ignoring the fact that Broadwell-E had this exact same layered substrate. Why are we pretending this is something entirely new? Even the article fails to mention that fact. Here we have the 6950X (top) and 5960X (bottom):

Because people are always quick to have a derisory did at company "X" and never quick to do some research first. 

 

EDIT: I think the reality is that there are only a few people on these forums who actually understand anything more deeply than model/performance numbers.  Everyone else just parrots the same assumed nonsense the last person said.