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AMD might announce their new CPU lineup on Tuesday

IAmAndre

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2 minutes ago, cj09beira said:

i mean the io die so its 14nm, btw they said 14nm not 16nm so its global foundries 

Yup. Also, looks like 8 channel memory.

 

Also, in a good bit of synergy, by being on 14nm at GloFo, they can literally copy & paste huge chunks of it and just rework the things they need. That's why Chiplet was where AMD had to go. They need to hedge against the Costs and design rework issues that Intel just pays through its nose through.

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Just now, Taf the Ghost said:

Yup. Also, looks like 8 channel memory.

 

Also, in a good bit of synergy, by being on 14nm at GloFo, they can literally copy & paste huge chunks of it and just rework the things they need. That's why Chiplet was where AMD had to go. They need to hedge against the Costs and design rework issues that Intel just pays through its nose through.

makes sense, just a bit worried about the latencies due to the extra chip on the consumer side

 

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Just now, Taf the Ghost said:

Yup. Also, looks like 8 channel memory.

 

Also, in a good bit of synergy, by being on 14nm at GloFo, they can literally copy & paste huge chunks of it and just rework the things they need. That's why Chiplet was where AMD had to go. They need to hedge against the Costs and design rework issues that Intel just pays through its nose through.

I still don't quite understand how they're able to make 7 nnm and 14 nnm work together, and whether or not that'll impact latency. But I'm quite dumb on CPU architecture, so won't say more than that

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Robert Hallock switched over to doing catering confirmed

 

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Just now, Deus Voltage said:

I still don't quite understand how they're able to make 7 nnm and 14 nnm work together, and whether or not that'll impact latency. But I'm quite dumb on CPU architecture, so won't say more than that

Been a lot of discussion about it since it went from Rumor to Leak. There are ways, as it's really just an iteration on the way Zen1 works, but the Memory Controller pretty much had to be on the I/O die. We'll see if it works as some rerouter, so there is actually memory channel controllers on the dies themselves, but there doesn't have to be.

 

If you think of the I/O die as a high speed Network Switch, it makes a lot more sense. It'll also act as a shared memory space, so no more NUMA vs UMA problems.

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now if their server sku can do 1800mhz, where can a crazy consumer take that to :)

vega clocked to 8-10% higher than that so its possible that amd breaks the 2 ghz mark under water

Just now, Deus Voltage said:

I still don't quite understand how they're able to make 7 nnm and 14 nnm work together, and whether or not that'll impact latency. But I'm quite dumb on CPU architecture, so won't say more than that

they make one die that only has the cpu cores, and the other has all the chipset, memory controllers, sata etc, the core die is on 7nm the other on 14nm, with some clever routing between both the chips they should be able to not loose too much latency due to that, but only when we get our hands on one will we know for sure 

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AMD mentioned 0.5x power at same performance as expected, but only 1.25x performance at the same power. That means a 100% increase in power for 7 nm will only result in 25% more performance.

 

What's up with the drop in expected CPU gains? Linear scaling would dictate 100% increase in performance at the same power, not a 25% increase. What is the 1.25x performance at same power and 0.5x power for same performance compared to for reference? Does 7 nm have bad frequency scaling? Is core count going to remain the same, but heavy overclocking possible (confused since servers will NOT overclock)?

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By way of reminder, the ~210 mm2 Zen Dies were costing AMD something like 20-25USD each and were yielding over 85%. This I/O die (I hope they release the project's name, something like Basilica or something) should be extremely cheap to produce. 

 

Also, and this is something that we don't know all of the implications of yet, but they could run out Semi-Custom versions of it. How about a some Vega CUs on that die?

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Just now, Taf the Ghost said:

Also, and this is something that we don't know all of the implications of yet, but they could run out Semi-Custom versions of it. How about a some Vega CUs on that die?

its possible to do this and just give it some cache to run on. i mean the die is supposed to be very cheap. how about a single CU for Display out?

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???? ヽ༼ຈل͜ຈ༽ノ GO VOTE or RIOT ヽ༼ຈل͜ຈ༽ノ ????

PLEASE QUOTE ME IF YOU ARE REPLYING TO ME

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2 minutes ago, VegetableStu said:

Vegaripper when?

Vega 64 + threadripper 16 core + 32GB of shared HBM cache + up to 1 terabyte of shared DDR4

 

sign me up (8 years down the line when i can afford it)

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2 minutes ago, Taf the Ghost said:

By way of reminder, the ~210 mm2 Zen Dies were costing AMD something like 20-25USD each and were yielding over 85%. This I/O die (I hope they release the project's name, something like Basilica or something) should be extremely cheap to produce. 

 

Also, and this is something that we don't know all of the implications of yet, but they could run out Semi-Custom versions of it. How about a some Vega CUs on that die?

ya this could also mean that say microsoft wants a custom die, they could just modify the io die and use the existing core die, or have a io die and a gpu die (going back to multiple chips )

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PCIE 4.0??? 

ƆԀ S₱▓Ɇ▓cs: i7 6ʇɥפᴉƎ00K (4.4ghz), Asus DeLuxe X99A II, GT҉X҉1҉0҉8҉0 Zotac Amp ExTrꍟꎭe),Si6F4Gb D???????r PlatinUm, EVGA G2 Sǝʌǝᘉ5ᙣᙍᖇᓎᙎᗅᖶt, Phanteks Enthoo Primo, 3TB WD Black, 500gb 850 Evo, H100iGeeTeeX, Windows 10, K70 R̸̢̡̭͍͕̱̭̟̩̀̀̃́̃͒̈́̈́͑̑́̆͘͜ͅG̶̦̬͊́B̸͈̝̖͗̈́, G502, HyperX Cloud 2s, Asus MX34. פN∩SW∀S 960 EVO

Just keeping this here as a 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2 minutes ago, GoldenLag said:

Vega 64 + threadripper 16 core + 32GB of shared HBM cache + up to 1 terabyte of shared DDR4

 

sign me up (8 years down the line when i can afford it)

low cost hbm might come to cpus in the future, as a form of L4/ram hybrid

 

stream resuming

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Man the stream comments are out of hand, someone wanted to see Lisa Su n****

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2 minutes ago, cj09beira said:

ya this could also mean that say microsoft wants a custom die, they could just modify the io die and use the existing core die, or have a io die and a gpu die (going back to multiple chips )

I imagine the I/O die was also part of their Semi-Custom strategy as well. Be the first time you can really just dial-up an entire chunk of a CPU design on the "cheap". And by cheap, I mean AMD probably charges 100m USD for the design & production + on-going IP and production costs. 

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3 minutes ago, BuckGup said:

PCIE 4.0??? 

YE

PLEASE QUOTE ME IF YOU ARE REPLYING TO ME

Desktop Build: Ryzen 7 2700X @ 4.0GHz, AsRock Fatal1ty X370 Professional Gaming, 48GB Corsair DDR4 @ 3000MHz, RX5700 XT 8GB Sapphire Nitro+, Benq XL2730 1440p 144Hz FS

Retro Build: Intel Pentium III @ 500 MHz, Dell Optiplex G1 Full AT Tower, 768MB SDRAM @ 133MHz, Integrated Graphics, Generic 1024x768 60Hz Monitor


 

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1 minute ago, VegetableStu said:

prepare for die shots or topology diagrams o_o

we want die and substrate shots. the best kind of shots.

 

screw real shots, its all about virtual digital shots

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Just now, GoldenLag said:

we want die and substrate shots. the best kind of shots.

 

screw real shots, its all about virtual digital shots

Are we still talking about CPU's? :D 

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4 minutes ago, GoldenLag said:

like how Nvidia is there. 

ya nvidea would probably prefer a amd vs intel vs nvidea market than a nvidea vs intel as with them now working on gpus they might try to remove pcie to destroy nvidea overnight 

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