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"Slightly thicker than human hair": world's thinnest vapor chamber announced

BachChain
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Summary

Cooler Master, the well known maker of PC peripherals and cooling solutions, has revealed their latest innovation: a vapor chamber so thin that it's thickness is comparable to that of a single strand of hair. Measuring at just 200um, the chamber is designed for laptops and mobile devices where conventional cooling solutions are considered impractical or inadequate.

 

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Although the technology has been announced, there are currently no commercially available products that utilize it. Those are expected to take another 2-3 years to appear.

 

Quotes

Quote

 Cooler Master noted in its reveal that microchip processors, whether that be CPUs, chipsets, GPUs, or other types of processors, are becoming so small that conventional cooling is becoming inadequate for them. More specifically, coolers that use regular heat pipes are becoming incapable of transferring enough heat away from our modern tiny microchip processors, simply because they are too large.

 

This is mostly a problem in more compact devices, like phones, tablets, and laptops. For now, at least, standard desktop computers don’t really have this issue, since they don’t have the same size constraints as other devices.

 

My thoughts

I have a hard time imagining that at this scale, it would be any better than just a regular sheet of copper. This also doesn't solve the dissipation issue. But CM seems to think it's worth investing in, so they must know something I don't.

 

Sources

https://www.tomshardware.com/amp/news/cooler-master-worlds-thinnest-vapor-chamber

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Kind of hard to wrap my head around that something so thin has enough volume to dissipate the amount of heat CPUs, Memory Modules, GPUs...etc generate.

If they managed to thin it up that much without a major performance degradation compared to other counterparts in the market, then congrats that's some good shit. 

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Imagine if they use these for each fin of a heatsink... that would be mental

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I could see this being used in phones to spread the heat more effectively from the SOC.

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Thermal pad vapor chambers???

▓ƆԀ▓ S▓₱▓Ɇ▓c▓s▓: i7 6ʇɥפᴉƎ00K (4.4ghz), Asus DeLuxe X99A II, GT҉X҉1҉0҉8҉0 Zotac Amp ExTrꍟꎭe),Si6F4Gb D???????r PlatinUm, EVGA G2 Sǝʌǝᘉ5ᙣᙍᖇᓎᙎᗅᖶt, Phanteks Enthoo Primo, 3TB WD Black, 500gb 850 Evo, H100iGeeTeeX, Windows 10, K70 R̸̢̡̭͍͕̱̭̟̩̀̀̃́̃͒̈́̈́͑̑́̆͘͜ͅG̶̦̬͊́B̸͈̝̖͗̈́, G502, HyperX Cloud 2s, Asus MX34. פN∩SW∀S 960 EVO

Just keeping this here as a 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Posted

Cool

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Posted
3 hours ago, GOTSpectrum said:

Imagine if they use these for each fin of a heatsink... that would be mental

It would actually make sense. Heatpipe transport heat very quickly, but once heat hits the fins, the heat kinda gets stuck there. Each fin being vapor chamber would accelerate spreading of heat. I just can't imagine the complexity of such design as well as the cost of it.

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32 minutes ago, RejZoR said:

It would actually make sense. Heatpipe transport heat very quickly, but once heat hits the fins, the heat kinda gets stuck there. Each fin being vapor chamber would accelerate spreading of heat. I just can't imagine the complexity of such design as well as the cost of it.

I'm aware that's why I said it. although, much like you I presume the cost would be too great for a feasible product. MAYBE they could use it for 1U server coolers, that would be interesting

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Posted
16 minutes ago, GOTSpectrum said:

I'm aware that's why I said it. although, much like you I presume the cost would be too great for a feasible product. MAYBE they could use it for 1U server coolers, that would be interesting

Thing with servers is they just use brute force to offset that. 15k RPM fans are a common thing there as noise is irrelevant factor. At home, most of my fans run at 600 RPM most of the time and only go up to like 2200 RPM max under full load.

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Posted

Imagine like an M1 or ASi device with this. They could cool it - if this performs the same as other heatsinks - without any design change at all.

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To me the craziest part is making something so thin, and how it somehow resists being bent and crushed - Cause there does need to be mounting pressure.

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Posted (edited)
On 5/25/2021 at 11:50 PM, BachChain said:

Summary

Cooler Master, the well known maker of PC peripherals and cooling solutions, has revealed their latest innovation: a vapor chamber so thin that it's thickness is comparable to that of a single strand of hair. Measuring at just 200um, the chamber is designed for laptops and mobile devices where conventional cooling solutions are considered impractical or inadequate.

 

SRV96JGNVvCcb54E47CBtb-1280-80.jpg

 

Although the technology has been announced, there are currently no commercially available products that utilize it. Those are expected to take another 2-3 years to appear.

 

Quotes

 

My thoughts

I have a hard time imagining that at this scale, it would be any better than just a regular sheet of copper. This also doesn't solve the dissipation issue. But CM seems to think it's worth investing in, so they must know something I don't.

 

Sources

https://www.tomshardware.com/amp/news/cooler-master-worlds-thinnest-vapor-chamber

Might depend on weight and metal cost.  That this is being looked at as a think implies copper is getting really really pricey. Might also transport heat faster.  There is a phase change involved.  A question for physicists.  The thing I notice is there’s no scintered spheres or mesh there.  The gas bubbles wouldn’t be small anymore at that scale though.  Might be considered something other than a vapor chamber at that point as it’s using different concepts.

Edited by Bombastinator

Not a pro, not even very good.  I’m just old and have time currently.  Assuming I know a lot about computers can be a mistake.

 

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