Ryzen 7000 IHS Design: Cleaning thermal paste off of this thing is going to be miserable...

[Founders]

I realize what Dr. Lisa Su unveiled is just an early engineering sample and it's not necessarily finalized yet. I'm just wondering if any of their engineers stopped to think before they settled on this design how difficult it would be to actually clean thermal paste off of it. It's not something we have to do often but cleaning between that IHS's toes would be pretty tedious. Am I alone in my thinking here or have any of you reached similar conclusions?        

 

[the gamer that is bad]

Perhaps those holes will be filled with epoxy or something similar to fill those holes?

[porina]

Assuming you're using a non-conductive paste the only place you need to clean is the top, and that'll be no worse than it is today. If paste gets down that's just cosmetic and no one is going to see it.

[jaslion]

Those holes seem to have been made to accommodate those pins. Those pins are used for testing so pretty much expect a normal ihs in the final sample.

[freeagent]

Look how small it is relative to the PCB.. its so cute

[Windows7ge]

I'm more surprised at the fact AMD is moving their desktop line to LGA.

 

At last people will stop ripping CPU's out of their sockets whenever they remove the CPU cooler.

 

But yeah, have to wait and see what the final design actually ends up being. If people don't overdo it on the thermal paste though it shouldn't be that bad. A Q-tip or two should clean up the edges just fine.

 

Alternatively everyone could move to using graphite sheets. They've been phenomenal for me.

[BiotechBen]

6 minutes ago, Windows7ge said:

I'm more surprised at the fact AMD is moving their desktop line to LGA.

 

At last people will stop ripping CPU's out of their sockets whenever they remove the CPU cooler.

 

But yeah, have to wait and see what the final design actually ends up being. If people don't overdo it on the thermal paste though it shouldn't be that bad. A Q-tip or two should clean up the edges just fine.

 

Alternatively everyone could move to using graphite sheets. They've been phenomenal for me.

Agree, less is more for thermal paste. Put it on, give it a little pressure, and if it looks like it's gonna goop, wipe it up before it does.

[porina]

31 minutes ago, jaslion said:

Those holes seem to have been made to accommodate those pins. Those pins are used for testing so pretty much expect a normal ihs in the final sample.

They don't look like test pins to me. They're surface mount component pads, some of which you can see are populated. They may decide they don't need all of them on final product.

[LAwLz]

6 minutes ago, porina said:

They don't look like test pins to me. They're surface mount component pads, some of which you can see are populated. They may decide they don't need all of them on final product.

To be more precise, they are part of the power delivery. 

[DildorTheDecent]

51 minutes ago, Windows7ge said:

At last people will stop ripping CPU's out of their sockets whenever they remove the CPU cooler.

>ywn be able to speedrun CPU removal on AM5.

[Founders]

19 hours ago, Windows7ge said:

I'm more surprised at the fact AMD is moving their desktop line to LGA.

 

At last people will stop ripping CPU's out of their sockets whenever they remove the CPU cooler.

I'm not too surprised but I think it's long overdue. The number of new builders bending or breaking pins is an issue AMD had been dealing with for years. Those of you with a Micro Center near by have probably seen the CPUs marked down with bent pins. 

18 hours ago, DildorTheDecent said:

>ywn be able to speedrun CPU removal on AM5.

Haha, best case here is you pull up on your cooler and find your CPU still stuck to it. Worst case, and probably more common, you drop your CPU and play some pin pick up. All it takes is a few wiggles of your cooler first and you're good to go.