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I was talking tech with a friend of mine, and I mentioned that I want to use a Ryzen 5 1600 in my new build. He told me that I needed to get a beefy cooler, because AMD CPUs have issues with overheating. Is this still true? Or, more specifically, is this true of Ryzen CPUs?

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no it was only an issue with 1 cpu really, the fx 9590. 

amds stock cooler on ryzen is good enough for even a light oc on a 1600. 

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Old AMD chips had cooling needs, but Ryzen can be cooled quite well with the stock heatsink.

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nah, nowadays it's Intel chips that you want to get a super beefy cooler for, old AMD (fx8000+) were freaking space heaters like the 8700k is. Ryzen is nice and cool like Intel used to be xD

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No absolutely not. Ryzen chips are very efficient. 

 

I have my r5 1600 overclocked to 3.8GHz at 1.33v and during gaming the highest temperature I've recorded is 54°c with the stock cooler on a "quiet" fan curve.  

 

The stock cooler is great. Don't listen to your friend, he's talking shite. 

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FX cpu's can have a TDP up to 200w+, most ryzens are 65w or 95w, it's a massive difference.

These days it's Intel that has cpu's that run hot.

 

If you compare threadripper with the top-end of skylake-x it's quite clear tbh.

https://www.gamersnexus.net/hwreviews/3066-intel-i9-7980xe-7960x-thermals-power-review

 

 

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Modern CPUs take thermals into account when operating at stock settings. Unless you start overclocking all modern chips will run warm but not "hot". Some chips in the past have run a bit hot but that's because they pushed the architecture too hard.

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Yup, I agree with everyone here, i have a 1600X and a BeQuiet! Pure Rock and the fans run at around 600-900RPM and with my chip overclocked at 3.95Ghz which is my every day overclock at 1.36v and I dont see temps raise above 65 degrees

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It's not true for Ryzen chips. In fact it's the exact opposite because of a soldered heatspreader.

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After Ivy Bridge Intel stopped to use a metal solder between cores and heat spreader and started to use regular thermal paste. They continued to put solder in Broadwell E etc. but in Kaby Lake X they stopped it too. Now they're only using solder in Xeon series. AMD never stopped to use quality solder. So if you look now between Ryzen and coffe lake it's opposite. Intel would heat more in theory.

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25 minutes ago, Nazim Pasa said:

After Ivy Bridge Intel stopped to use a metal solder between cores and heat spreader and started to use regular thermal paste. They continued to put solder in Broadwell E etc. but in Kaby Lake X they stopped it too. Now they're only using solder in Xeon series. AMD never stopped to use quality solder. So if you look now between Ryzen and coffe lake it's opposite. Intel would heat more in theory.

well solder has its own set of issues, if intel didn't use a crap ton of gasket material to hold the ihs on they wouldn't have so many temp issues

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