22°C diff by changing thermal paste? Tom's.

[Jahramika]

On 3/25/2017 at 4:50 PM, zMeul said:

it does do a better job, Ryzen's die has more surface to work with

but .. it still up in the air how it will performs in months, years down the road

Lol shill Intel defender 20 degrees after deciding is not better.

[iamdarkyoshi]

58 minutes ago, Jahramika said:

Lol 20 degrees and no warrenty Intel the way it should be.

Actually without delidding it again, it legitimately looks identical to the stock CPU, I left the bottom glue

[wzrd]

Side note that hasn't been mentioned yet, the 20C differences are only really seen at high overclocks, under max loads and with high end cooling solutions.

 

I get approx. 17C difference at max load at 5.1GHz overclock, which is huge, but only 6C at stock clocks, even under max loads. The longevity of liquid metal is also questionable, as anyone who used it as a TIM for a CPU block during the initial craze knows all too well (raises hand). To be fair to Intel, soldering a die as small as that of a 7700k is completely impractical and has too small a margin for error; we would likely see a huge amount of faulty chips if they did. They also have to consider the longevity of the chip; many PCs will be running these chips for seven or eight years, so they do need to take that into consideration as the Kaby Lake chips are consumer class products.

 

For high overclocking, it does make a massive difference, but it's definitely not a necessity for the average consumer. With a decent cooling solution, the average consumer could definitely run a 7700k at a comfortable 4.7GHz with minimal tweaking and without a delid, and would then likely see little to no practical difference in performance. At that point, it seems pretty clear that a delid does not have a great risk/reward outcome for your average consumer.

 

As an aside, it would be amazing to see Intel sell the higher end i7s without an IHS at all, and let us add an aftermarket/custom IHS.