New cooling technology

[MisterH]

Hey guys !

I am a student at the University of Technology in Delft.
Together with a group of fellow students we are researching a new concept of cooling which seems be very useful for the cooling of desktop computers.
It is largely the same as watercooling, using a fluid for cooling, thus using a radiator and fans to transfer the heat out of the fluid.
The main difference is that you don't need a pump. The fluid runs using a specific physics phenomenon (I can't really go in detail here, sorry about that .. ) and temperature difference. This means, the higher the temperature difference, the higher the flow of fluid.

So, no pump, (nearly) no failure and less noise ...

Sounds good right ?!?

We don't really have a prototype or anything yet, it's just theory and math that says that all of this should work.
Therefore, I can't say anything yet about pricing, we just don't know yet.

Now, here's the thing. We think the technology is up to it, but we are looking to get better insights into what properties make a good cooling system and properties you value when buying a cooling system.
Furthermore, we are interested to see if you guys think it'll add something to the market or would you recon there is already enough products out there?

And of course, if you have any general questions or remarks ...

Thanks for helping us !!

 

 

[PopsicleHustler]

I think you've been beaten on this subject 

 

 

[VIVO-US]

Would this be similar to a heatpipe?  Heatpipes work by moving the sealed liquid to the hot area through capillary action, and the liquid then evaporates to carry the heat away, and condenses in the end close to the radiator.

[Jurrunio]

aaaaannnndddd back to the drawing board

[PopsicleHustler]

Just now, Jurrunio said:

aaaaannnndddd back to the drawing board

Ooof. I just imagine a young group of engineers thinking that they're onto something, only to have their dreams shattered by a forum reply.

[Jurrunio]

3 minutes ago, PopsicleHustler said:

Ooof. I just imagine a young group of engineers thinking that they're onto something, only to have their dreams shattered by a forum reply.

well, shooting down ideas is indeed a pretty big part of engineers' lives.

[VIVO-US]

10 minutes ago, Jurrunio said:

well, shooting down ideas is indeed a pretty big part of engineers' lives.

That's definitely true.  As one of my company's product engineers, I've had a lot of ideas that never made it past the drawing board for one reason or another.

[MisterH]

Thanks for the replies guys !

 

The movies were interesting and the biulds were nice and exotic, I liked them.
Yet, it seems they are working either by capillary action, which generates a limited flow, or phase change materials, which is required to deal with a lot of changes in volume and hence in pressure (especially when considering the liquid-to-gas phase change), which then puts some high demands on the system to withstand those.

Our technology uses another way to generate flow through the system, providing a superior flow in comparison to capillary action-based coolers and at significant less pressure difference than a phase-change based cooler.
So I feel we're not entirely out of the game yet .. although that would indeed be part of a researchers life ...

[MisterH]

By the way, we would like to include your answers in our research, if that is ok for you guys of course.

We are either consider to include some screenshots or take some quotes.

If not, please let me know !

 

And if you have any special requests, want to be mentioned by your real name or company, something like that, feel free to DM me!

[Whiro]

And from now on people from this forum start to get quoted in some researches 

“Experts from Linus Tech Tips Forum said..... “  

[Canoe]

I believe there are four tasks involved:

• get the heat away from the CPU package fast enough so it's not damaged nor timing is affected
  • specifically, getting the heat away from the points of thermal load on the package
• absorb that heat, ready for transport
• transport that heat/heated-medium out of the case
  • I don't understand why products don't insulate the hot line on its path to the rad liquid-to-air heat exchanger; why let it heat the air and radiate to components inside the case?
  • And keep the hot and return lines well separated (insulated?) to prevent counter-flow heat exchange that degrades efficiency.
• getting rid of the heat from the cooling medium before it flows back to the CPU to absorb more heat

If the numbers shows your tech can't get the heat away from the cores within the package fast enough, but can scale (and fit) to handle removing enough heat from the case, consider that the first step may be obtained by a flat-plate heat-pipe on the CPU package. It can distribute (with no moving parts) the heat of the point thermal loads (regardless of where they are on the package) out evenly over a larger area and away to the condenser side of the plate, then your tech absorbs the heat presented at the condenser side and away and out of the case.

 

Make sure you post back to this thread to explain what you did, success or failure, when you're able to.