Jump to content
Search In
  • More options...
Find results that contain...
Find results in...
MisterH

New cooling technology

Recommended Posts

Posted · Original PosterOP


Hey guys !

I am a student at the University of Technology in Delft.
Together with a group of fellow students we are researching a new concept of cooling which seems be very useful for the cooling of desktop computers.
It is largely the same as watercooling, using a fluid for cooling, thus using a radiator and fans to transfer the heat out of the fluid.
The main difference is that you don't need a pump. The fluid runs using a specific physics phenomenon (I can't really go in detail here, sorry about that .. ) and temperature difference. This means, the higher the temperature difference, the higher the flow of fluid.

So, no pump, (nearly) no failure and less noise ...

Sounds good right ?!?

We don't really have a prototype or anything yet, it's just theory and math that says that all of this should work.
Therefore, I can't say anything yet about pricing, we just don't know yet.


Now, here's the thing. We think the technology is up to it, but we are looking to get better insights into what properties make a good cooling system and properties you value when buying a cooling system.
Furthermore, we are interested to see if you guys think it'll add something to the market or would you recon there is already enough products out there?

And of course, if you have any general questions or remarks ...

Thanks for helping us !!

 

 

Link to post
Share on other sites

I think you've been beaten on this subject 

 

 


Main system: i7 8700k 5Ghz / Asus Prime Z370-A / Corsair Vengeance 2x8GB 3000Mhz / Gigabyte RTX2080 Aorus Extreme / EVGA 750W GQ / Fractal Design Meshify C

Link to post
Share on other sites
9 minutes ago, PopsicleHustler said:

I think you've been beaten on this subject 

 

 

you beat me to it, yeah OP, it's already been done sorry


Main Rig: Custom Built: AMD Ryzen 3 3200G @ 3.6Ghz, 2x8GB Kingston Valueram @ 2666Mhz, Radeon Vega 8, Gigabyte A320M-S2H, Kingston 120Gb M.2 SSD,WD Blue 2.5 Inch 1tb HDD,Cooler Master MWE450, Aerocool CS-100

Laptop: HP ProBook X360 G1 EE: Pentium N4200 @ 1.1Ghz, 4Gb DDR3 1600Mhz 128Gb SSD
NAS Server: Dell OptiPlex 7010: Dual core Celeron G1610 @ 2.6Ghz 4GB DDR3 Ram, 500GB Single HDD

Mothballed Optiplex: Dual core Celeron G1810, 4Gb Ram, 250Gb HDD

Link to post
Share on other sites

Would this be similar to a heatpipe?  Heatpipes work by moving the sealed liquid to the hot area through capillary action, and the liquid then evaporates to carry the heat away, and condenses in the end close to the radiator.

Link to post
Share on other sites

aaaaannnndddd back to the drawing board


CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: 1TB HP EX920 PCIe x4 M.2 SSD + 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172), 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

Link to post
Share on other sites
Just now, Jurrunio said:

aaaaannnndddd back to the drawing board

Ooof. I just imagine a young group of engineers thinking that they're onto something, only to have their dreams shattered by a forum reply.


Main system: i7 8700k 5Ghz / Asus Prime Z370-A / Corsair Vengeance 2x8GB 3000Mhz / Gigabyte RTX2080 Aorus Extreme / EVGA 750W GQ / Fractal Design Meshify C

Link to post
Share on other sites
3 minutes ago, PopsicleHustler said:

Ooof. I just imagine a young group of engineers thinking that they're onto something, only to have their dreams shattered by a forum reply.

well, shooting down ideas is indeed a pretty big part of engineers' lives.


CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: 1TB HP EX920 PCIe x4 M.2 SSD + 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172), 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

Link to post
Share on other sites
10 minutes ago, Jurrunio said:

well, shooting down ideas is indeed a pretty big part of engineers' lives.

That's definitely true.  As one of my company's product engineers, I've had a lot of ideas that never made it past the drawing board for one reason or another.

Link to post
Share on other sites
Posted · Original PosterOP

Thanks for the replies guys !

 

The movies were interesting and the biulds were nice and exotic, I liked them.
Yet, it seems they are working either by capillary action, which generates a limited flow, or phase change materials, which is required to deal with a lot of changes in volume and hence in pressure (especially when considering the liquid-to-gas phase change), which then puts some high demands on the system to withstand those.

Our technology uses another way to generate flow through the system, providing a superior flow in comparison to capillary action-based coolers and at significant less pressure difference than a phase-change based cooler.
So I feel we're not entirely out of the game yet .. although that would indeed be part of a researchers life ...

Link to post
Share on other sites
Posted · Original PosterOP


By the way, we would like to include your answers in our research, if that is ok for you guys of course.

We are either consider to include some screenshots or take some quotes.

If not, please let me know !

 

And if you have any special requests, want to be mentioned by your real name or company, something like that, feel free to DM me!

Link to post
Share on other sites

And from now on people from this forum start to get quoted in some researches 

“Experts from Linus Tech Tips Forum said..... “ 😂 


   @Whiro tag or quote will do the trick 
i5 3570K @ 4.5Ghz  |  CM Hyper 212 Black  |  AsRock Fatal1ty Z77 Performance  |  Corsair Vengeance 16GB (4x4) 1600MHz  |  ASUS Strix GTX 970 OC  |  Phanteks P400S TG  |  EVGA 500W1  |  Storage: Corsair 60GB SSD (boot), Gigabyte 120GB SSD, WD 2Tb HDD

 

                                          WHIRO

         THE FIRST OF DEATH AND DARKNESS

 

        He feast on the dead to inherit their power

Link to post
Share on other sites

I believe there are four tasks involved:

  • get the heat away from the CPU package fast enough so it's not damaged nor timing is affected
    • specifically, getting the heat away from the points of thermal load on the package
  • absorb that heat, ready for transport
  • transport that heat/heated-medium out of the case
    • I don't understand why products don't insulate the hot line on its path to the rad liquid-to-air heat exchanger; why let it heat the air and radiate to components inside the case?
    • And keep the hot and return lines well separated (insulated?) to prevent counter-flow heat exchange that degrades efficiency.
  • getting rid of the heat from the cooling medium before it flows back to the CPU to absorb more heat

If the numbers shows your tech can't get the heat away from the cores within the package fast enough, but can scale (and fit) to handle removing enough heat from the case, consider that the first step may be obtained by a flat-plate heat-pipe on the CPU package. It can distribute (with no moving parts) the heat of the point thermal loads (regardless of where they are on the package) out evenly over a larger area and away to the condenser side of the plate, then your tech absorbs the heat presented at the condenser side and away and out of the case.

 

Make sure you post back to this thread to explain what you did, success or failure, when you're able to.

Link to post
Share on other sites

Create an account or sign in to comment

You need to be a member in order to leave a comment

Create an account

Sign up for a new account in our community. It's easy!

Register a new account

Sign in

Already have an account? Sign in here.

Sign In Now


×