New type of cooling without thermal paste

[cryoarun]

Had an idea, how about instead of using thermal paste to fill the air gap between the CPU IHS and Cooler Pad , we instead use slots on both IHS and Cooler Pad and sort of wedge them together before installing the cpu on the mother board socket. This would ensure zero gap between IHS and Cooler Pad and hopefully increase in thermal performance. IDK if anyone has tried this yet. I would love if Linus tries it out as an experiment and compare the results with stock Cooler with thermal paste.

[Eigenvektor]

I think I know what you're getting at, but the problem is that this would require a very precise manufacturing process with very low tolerances to pull off. This would be a lot more expensive than what we have now. Getting a polished plane metal surface is much easier.

 

Since you probably can't ensure such tight tolerances between parts of different manufacturers, your "jigsaw" pattern would require even more of an air gap, so you would need more, not less thermal paste.

[Phas3L0ck]

This concept is obsolete. It's been done before; tried and failed on older enterprise systems and early generations of desktops. The difference in efficiency is zero.

[Eigenvektor]

This is a double post btw: