Carbon Nanotube Storage Coming To Market - SSDs in 2018!!!

[laminutederire]

1 hour ago, patrickjp93 said:

They paid GloFo to take their last foundry. The expenses were too high and were eating far too much into profits. That, and IBM is swiftly taking over cloud integration. 

 

They didn't have the lead and didn't have the will to bring it to market when selling so few chips. Samsung and Intel have the lead. All IBM did is put a couple extra drops in a competitor it thought stood a chance.

Okay! The way I understood it was that they sold their silicon process to focus on carbon based process

[Doobeedoo]

Amazing!
It's such a potential in speed and in endurance being said to be practically limitless due to how strong the material is.

[Energycore]

15 hours ago, patrickjp93 said:

CNT won't be ready for that for at least 5 years. Samsung and Intel are racing for it though.

Oh man. Alternatives to silicon processes are exciting!

 

What I would really like, is to be able to store stuff on the same board (DIMM) that houses the system memory. With 32GB DIMMs available these days, and with NRAM not erasing when powered off, me may end up buying memory that doubles as storage.

[TidaLWaveZ]

oooohhhs and aaaahhhhhs!

[ScratchCat]

Just as I install my first SSD this turns up.
(Pissed off face)

[jonfrost53]

http://news.wisc.edu/for-first-time-carbon-nanotube-transistors-outperformsilicon

[shdowhunt60]

On 9/1/2016 at 1:56 AM, patrickjp93 said:

IBM is out of the foundry game, so it would be GloFo now (HAH!).

 

To be fair, IBM is heavily backing up GloFo now. Hopefully that means they can stop being shit. Or who knows, maybe TSMC will step up to bat since they're the ones being competitive now.

On 8/31/2016 at 6:52 PM, patrickjp93 said:

CNT won't be ready for that for at least 5 years. Samsung and Intel are racing for it though.

I thought the next big thing was supposed to be SiGe.

[Stefan1024]

On 09/01/2016 at 1:57 AM, LucidMew said:

Carbon Nanotubes can do anything!!! ^{besides leave the lab}

 - some guy I ripped the saying off of

CNT are actually used in some products nowadays. They are added to plastics to increase the strength, but compared to glas they don't break.

However, this doe not require controll of a single CNT and a few defects are not relevant. Building some RAM is much more difficult.

[patrickjp93]

5 hours ago, shdowhunt60 said:

 

To be fair, IBM is heavily backing up GloFo now. Hopefully that means they can stop being shit. Or who knows, maybe TSMC will step up to bat since they're the ones being competitive now.

I thought the next big thing was supposed to be SiGe.

SiGe is a crutch that only works down to 3nm and is close enough to silicon to be easier to work with. There's also the possibility Gallium Arsenide or another III-V material gets used. The goal is still CNT.