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About patrickjp93

  • Title
    Professional Learner
  • Birthday Nov 17, 1993

Profile Information

  • Location
    Brisbane, Australia
  • Gender
  • Interests
    Gaming, choir, GPGPU computing, Augmented Reality research, MicroArchitecture, and Graphene
  • Biography
    Spent 2 years in the Hellhole of the Texas elementary education system, then made a major upgrade to New Jersey. I'm now on my way to obtaining a Master's in Computer Science from Miami University in beautiful Oxford, Ohio. My research is on colorblindness and developing color and brightness correction to help impaired people (myself included) see the world as vividly as normal vision people.
  • Occupation
    Software Engineer for Suncorp in Brisbane, Australia


  • CPU
    I7 4960x
  • Motherboard
    Asus Rampage IV Black
  • RAM
    G.Skill Trident X 4x8 @ 2400 MHz
  • GPU
    2 EVGA GTX Titan Black Hydrocopper
  • Case
    Lian Li PC-A79B
  • Storage
    1 Samsung 840 EVO 1TB
  • PSU
    PC Power and Cooling 1250 Modular
  • Display(s)
    Dell Ultrasharp 24" 1920x1200
  • Cooling
    2 Alphacool 140mm x 80mm thick dual radiators___EK Elite CPU Block & Indigo XS TIM
  • Keyboard
    Cheap Dell Mechanical
  • Mouse
    Razer Mamba
  • Sound
    Sennheiser Gaming Headset

Recent Profile Visitors

9,341 profile views
  1. You will be missed.

    Rest in piece

    1.   Show previous replies  4 more
    2. Coaxialgamer


      *exploring derelict accounts*

    3. Tieox
    4. LucidMew



      I will miss the one sided flame wars

  2. I'm sorry but that's ridiculous. AMD is cherry picking components to compare. Anandtech will clear this up in short order after launch.
  3. The paste isn't the problem either. Both Intel and AMD use Dow Corning between the die and IHS (see AMD APUs). The problem is the glue Intel uses is so viscous the spacing between die and IHS is inconsistent and can be too large. That's the single biggest contributing factor to the temperatures. Just removing the glue and applying Dow Corning reduces temps by 15-20 degrees. The extra 5 CLU gets you is great, but you have to reapply CLU every 12 months or so.
  4. The substrate bends have all been found to be caused with abusive mounting force such as with a power drill. The reports stopped after the first few for exactly this reason. It's not an actual problem.
  5. The only die we have is an 8-core, and the 6900K is a cut-down 10-core die. Seriously people, think... And even if this is a quad-core module, Intel has the iGPU included and AMD doesn't. Either way, huge density DISadvantage for AMD.
  6. Considering they vastly outnumber GPUs and other accelerators in datacenters across the world, yes, they're typical. And mind you consumer software just doesn't make use of advanced CPUs. Hell games still really haven't discovered vectorization despite SSE being 11 years old now. We can get 10x CPU performance improvements from Sandy Bridge on just by changing some industry standard code into AVX intrinsics. You wouldn't even need multithreading at that point. 1 core on a 2600K using AVX can outperform the entire 6950X using scalar but multithreaded code. That should have the commu
  7. The very biggest chips in the world are CPUs. Knight's Landing is nearly 700mm sq.. The 8890 V3 is 662mm sq.. Back on 90nm the top Xeon was 710mm sq.. The biggest GPU die ever I believe was big Maxwell at just 610mm sq..
  8. Until you get to industry where the old guard is too set in its ways...
  9. This would be even faster, use the best networking, believe me. Also... XL!!! You can get 4TB SATA SSDs now, so half a Petabyte of high-speed storage is cache vs. the 1PB of SATA HDDs for big storage...
  10. Instead of the Storinator, it'll be "THE CACHINATOR SPEED DEMON XL!!!" Also, he'll get the 4TB versions TYVM...
  11. You just need an LSI card and 2 external enclosures You can run 128 drives off of a 2-port MegaRaid card.