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Relid i7-7700k

Bagera
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Hello

 

I finaly did it. Gathered all my courage and delided my i7-7700k because of the abnormally high temperatures. Replaced the TIM with Coollab liquid pro and reattached the lid with (black) High temp silicone. It all went smoothly.

I did this one hour ago. As it is drying inside the relid tool i'm wondering how long i have to let it dry before i can take it back into service.

 

Thx in advance

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I'm not sure if you're supposed to wait for it to dry--I never did. I just made sure things were aligned during installation before securing the cpu down with the retention bracket.

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14 minutes ago, WoodenMarker said:

I'm not sure if you're supposed to wait for it to dry--I never did. I just made sure things were aligned during installation before securing the cpu down with the retention bracket.

I'm at work right now so i have to wait at least 4 more hours before i get home. Reading your reply makes me assume it is safe to put inside the socket. I'll be careful when placing it back.

13 minutes ago, TrigrH said:

did you leave an air gap with the glue?

Yes i did leave that gap. Noticed it when deliding so assumed it has to be there. YT tutorials i watched didn't mention this. I'm glad i left the gap! Is the gap there to avoid building up high pressure?

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1 minute ago, Bagera said:

Yes i did leave that gap. Noticed it when deliding so assumed it has to be there. YT tutorials i watched didn't mention this. I'm glad i left the gap! Is the gap there to avoid building up high pressure?

If you don't, air bubbles will push the lid up when the processor runs and heats up.

CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: HP EX920 1TB PCIe x4 M.2 SSD + Crucial MX500 1TB 2.5" SATA SSD, 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally, 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172) left outside Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

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7 minutes ago, Bagera said:

Is the gap there to avoid building up high pressure?

Had to get a solid answer on that one, I've heard if any gases or anything need to escape they can, anyways intel must do it for a reason :P

 

Insert ram related question here: https://linustechtips.com/main/topic/1197132-setting-ram-speed-xmp-docp-for-dummies/

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