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NT-H1 is more versatile in a way, it's non conductive so it won't short out exposed dies such as GPUs if you ever want to replace GPU thermal compound or on anything really. As for both of them, I don't know, all I know is that AS5 has a curing time and is conductive, so not ideal for GPU or exposed die scenarios. I would personally get NT-H1 since it's a hobby of mine to go around and replace thermal paste on anything that needs it.

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@Shadskular, it comes down to what your thermal compound is okay with. Some thermal compounds work better with copper and don't like aluminium and some the other way. Depending on which CPU cooler you're using, for example the CM Nepton 240M (which is what I'm using), it has a copper plate so your thermal compound would have to be okay with copper.

 

I think that's how it goes, someone correct me if I'm wrong. 

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