Imec’s Plan For Continued Scaling

[nobodynobody]

Summary

Although there is a roadmap for everyone involved in semiconductor industry, detailed plans can differ.

 Sri Samevadam from IMEC (Interuniversity Microelectronics Centre) , made a keynote at IEDM (IEEE International Electron Devices Meeting), detailing his plans for device scaling. here are the key point:

    1/Dimensional scaling will continue.

    2/ Focus on new materials, especially 2D materials.

    3/Deconstructed Chips, novel 2D and 3D SoCs.

    4/EDAs need to mature for such tasks.

My thoughts

As Richard Feynman said :"There's Plenty of Room at the Bottom". 

 

Sources

https://semiengineering.com/imecs-plan-for-continued-scaling/

https://www.imec-int.com/en

https://ieee-iedm.org/