Where are the chiplets in the Zen3 processors?

[pipnina]

I have seen some talk about a "Three spot" thermal paste pattern being slightly more effective than the usual pea shape for the chiplet designs, and wanted to know if it's common knowledge yet where the chips are in the Zen3 lineup?

My first guess would have been that the IO chip is still in the middle of the package or there about. But I am not sure if, when looking at the CPU installed in a motherboard upright, if the core CCXs are above or to the left/right of that IO chip?

I know that usually there isn't much difference in these things, but I just wanted to make sure before I glue it all down

Cheers

[DildorTheDecent]

4 hours ago, pipnina said:

But I am not sure if, when looking at the CPU installed in a motherboard upright, if the core CCXs are above or to the left/right of that IO chip?

When the CPU is installed in the socket the I/O chiplet is at the top and the CPU chiplets are at the bottom.

 

der8auer used to sell "OC brackets" on caseking that show the layout of the dies:

 

X method is best method btw.

Spoiler

CPU in the normal orientation (as seen on marketing slides):

Spoiler

 

CPU in the socket:

Spoiler

 

[pipnina]

13 minutes ago, DildorTheDecent said:

When the CPU is installed in the socket the I/O chiplet is at the top and the CPU chiplets are at the bottom.

 

der8auer used to sell "OC brackets" on caseking that show the layout of the dies:

-snip-

Amazing! Thanks for the help!