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My first delid

Hey guys,

 

I'm going to delid my 8700k today which will also be my first delid ever. I hope that will negate my bad luck in the lottery, since I was unable to hit 5GHz at all, even with 1.375 volts on a 360 AIO.

You can imagine I'm a bit excited.

I watched a couple of tutorials on Youtube so I have a good grasp of what I have to do.

 

But do you have more tipps for me? Maybe some unusual ones?

 

My delid gear:

der8auer Delid-Die-Mate 2

Thermal Grizzly Conductonaut

Isopropanol 99,9%

Clear nail polish for isolating the 4 dots near the die

Uhu silicone glue although I don't know if I even will glue the heatspreader back together

My Gaming PC:
Inno3D iChill Black - RTX 4080 - +500 Memory, undervolted Core, 2xCorsair QX120 (push) + 2xInno3D 120mm (pull)
AMD Ryzen 7 7800X3D - NZXT x72
G.SKILL Trident Z @6000MHz CL30 - 2x16GB
Asus Strix X670E-E Gaming

1x500GB Samsung 960 Pro (Windows 11)

1x2TB Kingston KC3000 (Games)

1x1TB WD Blue SN550 (Programs)

1x1TB Samsung 870 EVO (Programs)
Corsair RM-850X

Lian Li O11 Vision
ASUS ROG Swift OLED PG27AQDM (240hz OLED), MSI Optix MAG274QRFDE-QD, BenQ ZOWIE XL2720

Logitech G Pro Wireless Superlight
Wooting 60HE

Audeze LCD2-C + FiiO K3

Klipsch RP600-M + Klipsch R-120 SW

 

My Notebook:

MacBook Pro 16 M1 - 16GB

 

Proxmox-Cluster:

  • Ryzen 9 3950X, Asus Strix X570E F-Gaming, 2x32GB3200MHz ECC, 2x 512GB NVMe ZFS-Mirror (Boot + Testing-VMs), 2x14TB ZFS-Mirror + 1x3TB (TrueNAS-VM), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 10G NIC
  • i7 8700k delidded undervolted, Gigabyte Z390 UD, 4x16GB 3200MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC
  • i5 4670, 3x4GB + 1x8GB 1600MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC

Proxmox-Backup-Server:

  • i5 4670, 4x4GB 1600MHz, 2x2TB ZFS-Mirror, 2,5G NIC
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I can speak from my experience, I have delidded 3 CPUs so far: 

1. Don't re-seal it if you don't have to. The space reduction underneath the heat spreader is what gives you the biggest heat decrease. 

2. You probably need more force than you think

3. While removing the heat spreader after using the Delid-Die-Mate, be extra careful to not rip off any small parts on the CPU. I destroyed a 600€ CPU because I wasn't careful in the last stage of the delid.

4. Finally, make sure to apply enough liquid metal to the CPU die as well as the heat spreader. Your temps will be awful if the liquid metal layers don't connect properly to each other. 

 

If all goes well, you will have a great overclocker at hand :)

 

Main Rig: EK custom loop |2700x @ 4.25 Ghz| Msi X470 Gaming Plus | 32gb DDR4 | Aorus GTX 1080ti @ 2088 Mhz | TT Core X71 TG | Samsung 970 Evo Plus 500gb + 256gb Toshiba NVMe + 275GB Crucial m.2

Laptop: Surface Book 2 15" |  i7 8650U 4.2 GHz | 16gb DDR3L | GTX 1060 6gb | 265GB NVMe SSD

https://de.pcpartpicker.com/list/9jvNnH

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18 minutes ago, Davidwr80 said:

3. While removing the heat spreader after using the Delid-Die-Mate, be extra careful to not rip off any small parts on the CPU. I destroyed a 600€ CPU because I wasn't careful in the last stage of the delid.

That's a good one.

Tank you, I hope it goes well :)

My Gaming PC:
Inno3D iChill Black - RTX 4080 - +500 Memory, undervolted Core, 2xCorsair QX120 (push) + 2xInno3D 120mm (pull)
AMD Ryzen 7 7800X3D - NZXT x72
G.SKILL Trident Z @6000MHz CL30 - 2x16GB
Asus Strix X670E-E Gaming

1x500GB Samsung 960 Pro (Windows 11)

1x2TB Kingston KC3000 (Games)

1x1TB WD Blue SN550 (Programs)

1x1TB Samsung 870 EVO (Programs)
Corsair RM-850X

Lian Li O11 Vision
ASUS ROG Swift OLED PG27AQDM (240hz OLED), MSI Optix MAG274QRFDE-QD, BenQ ZOWIE XL2720

Logitech G Pro Wireless Superlight
Wooting 60HE

Audeze LCD2-C + FiiO K3

Klipsch RP600-M + Klipsch R-120 SW

 

My Notebook:

MacBook Pro 16 M1 - 16GB

 

Proxmox-Cluster:

  • Ryzen 9 3950X, Asus Strix X570E F-Gaming, 2x32GB3200MHz ECC, 2x 512GB NVMe ZFS-Mirror (Boot + Testing-VMs), 2x14TB ZFS-Mirror + 1x3TB (TrueNAS-VM), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 10G NIC
  • i7 8700k delidded undervolted, Gigabyte Z390 UD, 4x16GB 3200MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC
  • i5 4670, 3x4GB + 1x8GB 1600MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC

Proxmox-Backup-Server:

  • i5 4670, 4x4GB 1600MHz, 2x2TB ZFS-Mirror, 2,5G NIC
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1 hour ago, Noah0302 said:

But do you have more tipps for me? Maybe some unusual ones?

it's not really hard to delid a cpu, just take your time with it :D

Recent build: Fractal Design - Torrent reviewMeshify C / The 1080TI Strix Noctua modDefine S X58 Xeon build  / Specs: i7-14700KF 5.8Ghz - ASUS TUF RTX 4080 super - G.Skill Ripjaws 32GB 4000mhz CL18 -  Gigabyte Z690 Gaming X d4 - Torrent Fractal Design white - EVGA 850W Supernova G2 80+ Gold - Noctua D15

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3 hours ago, Davidwr80 said:

1. Don't re-seal it if you don't have to. The space reduction underneath the heat spreader is what gives you the biggest heat decrease.

This.

I did mine without re-seal the IHS. Just hold the IHS inplace firm enough with the stock motherboard intel cpu retention tool. Be very careful when you hold it with your finger while you clipping it on the motherboard.

 

Here is mine,

 

My system specs:

Spoiler

CPU: Intel Core i7-8700K, 5GHz Delidded LM || CPU Cooler: Noctua NH-C14S w/ NF-A15 & NF-A14 Chromax fans in push-pull cofiguration || Motherboard: MSI Z370i Gaming Pro Carbon AC || RAM: Corsair Vengeance LPX DDR4 2x8Gb 2666 || GPU: EVGA GTX 1060 6Gb FTW2+ DT || Storage: Samsung 860 Evo M.2 SATA SSD 250Gb, 2x 2.5" HDDs 1Tb & 500Gb || ODD: 9mm Slim DVD RW || PSU: Corsair SF600 80+ Platinum || Case: Cougar QBX + 1x Noctua NF-R8 front intake + 2x Noctua NF-F12 iPPC top exhaust + Cougar stock 92mm DC fan rear exhaust || Monitor: ASUS VG248QE || Keyboard: Ducky One 2 Mini Cherry MX Red || Mouse: Logitech G703 || Audio: Corsair HS70 Wireless || Other: XBox One S Controler

My build logs:

 

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23 minutes ago, _Hustler_One_ said:

This.

I did mine without re-seal the IHS. Just hold the IHS inplace firm enough with the stock motherboard intel cpu retention tool. Be very careful when you hold it with your finger while you clipping it on the motherboard.

 

Here is mine,

 

I have always personally used RTV silicon gasket maker. I have tried both and seen no decrease in thermals with it.  I just out a small bead on the edge of the IHS and make sure to leave a gap of about a 1/4" or so on one side.  If you have the die mate just use the relid attachment. If now I just used a foam and clamp setup for about 2-4 hrs to let it set then let the socket hold it down which let's it completely dry over the next few days while you use it.

 

The benefit to this is that if you do it properly noone can tell it was ever delidded. I mean I have only personally killed one chip and it was a very long time ago. It was the old vise and block of wood/rubber mallet method. Chip went flying and didn't survive. I have used a razor blade for all my delids since.

 

 

Btw if you do not use an adhesive you need to move the IHS slightly down from center as it will move up when you clamp the chip down via the locking mechanism.

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2 minutes ago, AngryBeaver said:

I have always personally used RTV silicon gasket maker. I have tried both and seen no decrease in thermals with it.  I just out a small bead on the edge of the IHS and make sure to leave a gap of about a 1/4" or so on one side.  If you have the die mate just use the relid attachment. If now I just used a foam and clamp setup for about 2-4 hrs to let it set then let the socket hold it down which let's it completely dry over the next few days while you use it.

 

The benefit to this is that if you do it properly noone can tell it was ever delidded. I mean I have only personally killed one chip and it was a very long time ago. It was the old vise and block of wood/rubber mallet method. Chip went flying and didn't survive. I have used a razor blade for all my delids since.

That's one of my point. I will reseal it when it's the time I will sell it, but before that time is coming I will leave it without resealed, so If I need to reapplied the LM I can do it without any hassle.

My system specs:

Spoiler

CPU: Intel Core i7-8700K, 5GHz Delidded LM || CPU Cooler: Noctua NH-C14S w/ NF-A15 & NF-A14 Chromax fans in push-pull cofiguration || Motherboard: MSI Z370i Gaming Pro Carbon AC || RAM: Corsair Vengeance LPX DDR4 2x8Gb 2666 || GPU: EVGA GTX 1060 6Gb FTW2+ DT || Storage: Samsung 860 Evo M.2 SATA SSD 250Gb, 2x 2.5" HDDs 1Tb & 500Gb || ODD: 9mm Slim DVD RW || PSU: Corsair SF600 80+ Platinum || Case: Cougar QBX + 1x Noctua NF-R8 front intake + 2x Noctua NF-F12 iPPC top exhaust + Cougar stock 92mm DC fan rear exhaust || Monitor: ASUS VG248QE || Keyboard: Ducky One 2 Mini Cherry MX Red || Mouse: Logitech G703 || Audio: Corsair HS70 Wireless || Other: XBox One S Controler

My build logs:

 

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So I'm finished.

 

I went from 4.9GHz 1.325V 84C Cinebench

to 5GHz on 1.35V 66C

and 5.1GHz on 1.425V 79C

5.2 is not possible.

 

5GHz makes most sense here I think. This huge voltage and temp difference for 100MHz is not really worth it.

My Gaming PC:
Inno3D iChill Black - RTX 4080 - +500 Memory, undervolted Core, 2xCorsair QX120 (push) + 2xInno3D 120mm (pull)
AMD Ryzen 7 7800X3D - NZXT x72
G.SKILL Trident Z @6000MHz CL30 - 2x16GB
Asus Strix X670E-E Gaming

1x500GB Samsung 960 Pro (Windows 11)

1x2TB Kingston KC3000 (Games)

1x1TB WD Blue SN550 (Programs)

1x1TB Samsung 870 EVO (Programs)
Corsair RM-850X

Lian Li O11 Vision
ASUS ROG Swift OLED PG27AQDM (240hz OLED), MSI Optix MAG274QRFDE-QD, BenQ ZOWIE XL2720

Logitech G Pro Wireless Superlight
Wooting 60HE

Audeze LCD2-C + FiiO K3

Klipsch RP600-M + Klipsch R-120 SW

 

My Notebook:

MacBook Pro 16 M1 - 16GB

 

Proxmox-Cluster:

  • Ryzen 9 3950X, Asus Strix X570E F-Gaming, 2x32GB3200MHz ECC, 2x 512GB NVMe ZFS-Mirror (Boot + Testing-VMs), 2x14TB ZFS-Mirror + 1x3TB (TrueNAS-VM), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 10G NIC
  • i7 8700k delidded undervolted, Gigabyte Z390 UD, 4x16GB 3200MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC
  • i5 4670, 3x4GB + 1x8GB 1600MHz, 1x 512GB SSD (Boot), 1x 1TB Samsung 980 Pro NVMe (Ceph-OSD), 2,5G NIC

Proxmox-Backup-Server:

  • i5 4670, 4x4GB 1600MHz, 2x2TB ZFS-Mirror, 2,5G NIC
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Delid is best thing I ever did to mine

Before you reply to my post, REFRESH. 99.99% chance I edited my post. 

 

My System: i7-13700KF // Corsair iCUE H150i Elite Capellix // MSI MPG Z690 Edge Wifi // 32GB DDR5 G. SKILL RIPJAWS S5 6000 CL32 // Nvidia RTX 4070 Super FE // Corsair 5000D Airflow // Corsair SP120 RGB Pro x7 // Seasonic Focus Plus Gold 850w //1TB ADATA XPG SX8200 Pro/1TB Teamgroup MP33/2TB Seagate 7200RPM Hard Drive // Displays: LG Ultragear 32GP83B x2 // Royal Kludge RK100 // Logitech G Pro X Superlight // Sennheiser DROP PC38x

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9 hours ago, Noah0302 said:

Hey guys,

 

I'm going to delid my 8700k today which will also be my first delid ever. I hope that will negate my bad luck in the lottery, since I was unable to hit 5GHz at all, even with 1.375 volts on a 360 AIO.

You can imagine I'm a bit excited.

I watched a couple of tutorials on Youtube so I have a good grasp of what I have to do.

 

But do you have more tipps for me? Maybe some unusual ones?

 

My delid gear:

der8auer Delid-Die-Mate 2

Thermal Grizzly Conductonaut

Isopropanol 99,9%

Clear nail polish for isolating the 4 dots near the die

Uhu silicone glue although I don't know if I even will glue the heatspreader back together

My advice:
reseal with RTV silicone with four VERY TINY DOTS in each corner of the bottom of the IHS.  The smaller the better.

Then you get an easy reseal but without risk of having the IHS elevated higher.  RTV expands as it dries so a tiny dab makes things sealed without any drawbacks :)  You can also even re-delid with your fingers if you messed up the LM application.

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