Copper IHS?

[Nicool]

https://www.ebay.com/itm/DELID-RELID-service-COPPER-IHS-REPLACEMENT-for-Intel-8th-7th-6th-5-4th-Gen/232768300031?hash=item36321263ff:g:v9QAAOSweoBa-SbK

 

I just found this thing on ebay... do you think it better or worst than just the original IHS?

 

 

 

[wojtepanik]

yeah, it should, you can always polish it to gloss

[Pixel5]

it could be a little better then the original IHS but generally it wont matter much simply because anything you put in between is just another barrier you need to overcome.

 

the best thing you could do is direct die cooling.

[Jurrunio]

bad idea imo. Liquid metal contains Gallium (a significant portion of it actually), which forms alloy with Copper but not Nickel (material of the surface of stock IHS). This alloy has poor thermal conductivity and potentailly brittle (many other Gallium alloys are), so it might break or worsen your thermals.

 

Stock IHS isnt bad either. It's nickel-plated copper, so it's nearly as good in performance as copper-only IHS

[Lathlaer]

Intel IHS is already nickel-plated copper, I don't get the so-called benefits of that operation.

[monjessenstein]

I remember Gamers Nexus doing a video on something similair to this, and remember the temperature difference being negligible at around 2-3 degrees.

[SolarNova]

It will help, but only by a degree or two.

 

If your looking for every single degree of temp difference, for the best possible ambient cooling overclocks, then go for it. Otherwise dotn bother, as som1 mention, galium  which is present in i beleve all liquid metal TIM, will eventual alloy with the copper, so over time those few degrees you gained will likely disapper.

[Srnewbee]

yup, I read a few articles too that even a lapping the stock IHS is negligible.

[AnonymousGuy]

Basically there's no advantage to messing with the IHS at all.  Lapping it, machining it, replacing it with silver, etc.    You get more out of replacing your waterblock's mounting springs with stronger ones, to ensure high mounting/contact pressure.