Thermal paste and h100i

[Swegly]

So I am going to buy Arctic silver 5 paste for my CPU but people have been telling me opposite things reguarding application. Do I apply it to the h100i (like it comes preinstalled) or do I apply it to the cpu itself. Approximately how much do you think will get the job done?.. the tube is 3.5g. Also should I spread the thermal paste with a credit card because people have ran into issues using the blob or cross method. Thanks a lot and sorry for any misspellings I'm on my phone.

 

PS: Don't tell me to use the h100i thermal paste that it comes with because I have used it for over a year and going to replace it now.

[MegaDave91]

Grain of rice sized blob on the CPU. Don't spread it.

[Fictionvl]

You apply it to then CPU, and an uncooked grain of rice size pea should be fine for thermal paste, no need to spread or do the cross method.

[Swegly]

Grain of rice sized blob on the CPU. Don't spread it.

 

You apply it to then CPU, and an uncooked grain of rice size pea should be fine for thermal paste, no need to spread or do the cross method.

But if it is the size of rice and gets pressed out between the h100i and cpu, won't the edges of the cpu be missed?

[Fictionvl]

But if it is the size of rice and gets pressed out between the h100i and cpu, won't the edges of the cpu be missed?

it doesn't matter, the only thing that is near the sides of the CPU is the memory controller, the cores are in the middle part the rest is PCB

[MegaDave91]

But if it is the size of rice and gets pressed out between the h100i and cpu, won't the edges of the cpu be missed?

[airdeano]

major coverage would be like the picture above, enough to cover the die. the

minor coverage would be the rest of the IHS of the CPU. as long as the major

portion is covered the minor is "bonus".

 

the pea/grain method applies for both coverage. the tension of the cold plate

will distribute the paste.

 

AS5 will need a "cure/bake-in" to show best performance. most do not want

to wait and use the noctua nt-h1 or artic mx-4 (which require no cure-time).

[Swegly]

major coverage would be like the picture above, enough to cover the die. the

minor coverage would be the rest of the IHS of the CPU. as long as the major

portion is covered the minor is "bonus".

the pea/grain method applies for both coverage. the tension of the cold plate

will distribute the paste.

AS5 will need a "cure/bake-in" to show best performance. most do not want

to wait and use the noctua nt-h1 or artic mx-4 (which require no cure-time).

How do I do the burn in?