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i saw linus putting thermal paste like a grain of rice

 

But i say JayzTwoCents putting thermal paste in a star method

 

But the method of putting thermal paster matters?

 

Leave your comments down below and il see ya next time :3

not really, but considering that intel CPUs have a die that is taller than it is wide, I do a thin vertical line for enough coverage for the hottest parts of the Heat spreader, but will still result in a thin amount especially with high mounting pressure.

edit: 1111 posts

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Different methods for different dies (e.g. Haswell may require a small line, instead of a small pea shape).

I have been a fan of the pea shaped method for ever.

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But does your method our method affects the performance?

I would say it impacts it less than using a good material and less than using either too much or too little.

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a small pea sized under the pressure of the heat sink is gonna cover the whole chip pretty much anyway 

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Method always matters.

 

That said, you have to consider what thermal paste actually does: it facilitates the transfer of heat between the CPU and your cooler.  Chances are the natural spreading of the paste due to the pressure of the heatsink being mounted to it is more than sufficient and you'll receive damn near uniform coverage anyway.  

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when i did the line method i somehow got an air bubble... so i will only go with pea method.

Edit: bubble, more like air pocket.

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