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Hey, I bought the CARBONAUT 32x32 mm from thermal-grizzly a day ago as an alternative for thermal paste. and I did everything as described in the instructions and now I have a temperature of 60 to 70 degrees and in games like minecraft a temperature of 90 - 100 degrees.

 

cpu: i9900K
aio: corsair H150i Pro RGB

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Idk why you'd buy premium thermal paste alternative when you could have just gotten slightly better thermal paste instead.

 

the carbonaut looks like it's quite thin, possibly thinner than what thermal paste would be, meaning you're most likely required to carefully tighten the mounting pressure bit more than you would with thermal paste,

 

but of course you can't do too much because that would put strain on CPU or it's connection with the Motherboard, you don't want to break anything obviously.

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Feel free: To ask any question, no matter what question it is, I will try to answer. I know a lot about PCs but not everything.

current PC:

Ryzen 5 5600 |16GB DDR4 3200Mhz | B450 | GTX 1080 ti [further details on my profile]

PC configs I used before:

  1. Pentium G4500 | 4GB/8GB DDR4 2133Mhz | H110 | GTX 1050
  2. Ryzen 3 1200 3,5Ghz / OC:4Ghz | 8GB DDR4 2133Mhz / 16GB 3200Mhz | B450 | GTX 1050
  3. Ryzen 3 1200 3,5Ghz | 16GB 3200Mhz | B450 | GTX 1080 ti
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Could be a bad installation, could be a faulty AIO and pump. Only you can know for sure after doing some tests.

 

Try to observe and hear the pump and check to see if it's working, try to redo your installation. If there are bubbles and air stuck in the AIO you should be able to get them out by laying the PC down on its side taking the radiors out face up, and give it a good shake but not too violent.

 

You shouldn't hit 90c in Minecraft, but also check what CPU voltage you are getting. Reset your bios settings to default for good measure as well eventho you really shouldn't be hitting 90c in a game with any sort of bios settings.

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I go thin, but not translucent. 

AMD R9 9900X | Thermalright FW Pro Black, 3x TL-B12E | Asus Strix X670E -F | 64GB G.Skill 6000C26
Zotac 4070 Ti Trinity OC | WD SN850, SN850X, 2x SN770 | Seasonic Vertex GX-1000 | ProArt PA602
Adcom GFP-345, Adcom GFA-555, S.M.S.L D1+PS100, Cerwin-Vega! CLSC-15, Monster HDP-1800
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14 minutes ago, Blue4130 said:

Proper thermal paste should ideally be atoms thick. Much thinner than a pad/sheet.

in perfect world,

 

but micro-gaps and scratches and whatever on each plates of CPU and cooler heatplates means more air for sheets and less air for paste because it will just fill it

Note: Users receive notifications after Mentions & Quotes. 

Feel free: To ask any question, no matter what question it is, I will try to answer. I know a lot about PCs but not everything.

current PC:

Ryzen 5 5600 |16GB DDR4 3200Mhz | B450 | GTX 1080 ti [further details on my profile]

PC configs I used before:

  1. Pentium G4500 | 4GB/8GB DDR4 2133Mhz | H110 | GTX 1050
  2. Ryzen 3 1200 3,5Ghz / OC:4Ghz | 8GB DDR4 2133Mhz / 16GB 3200Mhz | B450 | GTX 1050
  3. Ryzen 3 1200 3,5Ghz | 16GB 3200Mhz | B450 | GTX 1080 ti
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2 minutes ago, podkall said:

in perfect world,

 

but micro-gaps and scratches and whatever on each plates of CPU and cooler heatplates means more air for sheets and less air for paste because it will just fill it

? Not sure how that relates to you saying that the sheet is thinner than paste. The paste is thinner because the mounting pressure presses it thin, filling only the pits and scratches, allowing essentially metal to metal contact. Sheets don't compress nearly as much as paste.

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4 minutes ago, Blue4130 said:

? Not sure how that relates to you saying that the sheet is thinner than paste. The paste is thinner because the mounting pressure presses it thin, filling only the pits and scratches, allowing essentially metal to metal contact. Sheets don't compress nearly as much as paste.

that is true, which means if the metal plates aren't perfectly flat, it can leave uneven mounting pressure which would have been solved by the paste that gets squished out of the thinner parts to fill in the more loose parts...

Note: Users receive notifications after Mentions & Quotes. 

Feel free: To ask any question, no matter what question it is, I will try to answer. I know a lot about PCs but not everything.

current PC:

Ryzen 5 5600 |16GB DDR4 3200Mhz | B450 | GTX 1080 ti [further details on my profile]

PC configs I used before:

  1. Pentium G4500 | 4GB/8GB DDR4 2133Mhz | H110 | GTX 1050
  2. Ryzen 3 1200 3,5Ghz / OC:4Ghz | 8GB DDR4 2133Mhz / 16GB 3200Mhz | B450 | GTX 1050
  3. Ryzen 3 1200 3,5Ghz | 16GB 3200Mhz | B450 | GTX 1080 ti
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1 minute ago, podkall said:

that is true, which means if the metal plates aren't perfectly flat, it can leave uneven mounting pressure which would have been solved by the paste that gets squished out of the thinner parts to fill in the more loose parts...

Which is why you can essentially never use "too much" paste. Other than making a giant mess. 😜

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Just now, Blue4130 said:

Which is why you can essentially never use "too much" paste. Other than making a giant mess. 😜

yes you can, with CPUs that have exposed bits, but I guess if you use non-conductive paste..

 

image.png.259d1075fa733e6fa0cdd7cdc7209e0d.png

Note: Users receive notifications after Mentions & Quotes. 

Feel free: To ask any question, no matter what question it is, I will try to answer. I know a lot about PCs but not everything.

current PC:

Ryzen 5 5600 |16GB DDR4 3200Mhz | B450 | GTX 1080 ti [further details on my profile]

PC configs I used before:

  1. Pentium G4500 | 4GB/8GB DDR4 2133Mhz | H110 | GTX 1050
  2. Ryzen 3 1200 3,5Ghz / OC:4Ghz | 8GB DDR4 2133Mhz / 16GB 3200Mhz | B450 | GTX 1050
  3. Ryzen 3 1200 3,5Ghz | 16GB 3200Mhz | B450 | GTX 1080 ti
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Check the mounting of the cooler, but the fact is the 8thh gen and 9th gen of intel should be delided because intel used cheap thermal compound between the IHS and the die so that's the problem. I would give the cpu to the pro's for them to delid it and replace the liquid metal

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