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Is it better to have a little bit too much, or a little less then you should?

 

I'm going to have to reapply paste when I switch motherboards. I'm aware there are a few methods of applying paste, but I think I'm going to go with the pea method (pea shape, not pea sized I believe is the right way to do it).

 

I just wanted to double check here before I went through with it. Thanks!!

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Both I suppose are equally bad. Not enough you over heat. To much you overheat. It isn't difficult to get the right amount though

well, too much and it usually just gets squeezed out the sides, creating an ugly mess.

      

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Either way we are talking about a few degrees , so it doesn't matter, tiny amount is usually reccommended , but i've seen extreme overclockers use a dollop of paste for subzero benchmarks.

Details separate people.

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That's already to little....

Some paste spread better than others, I'd just use the nt-h1 from noctua probably the easiest to work with. I used like half of what he used and it spreaded complety over my 3930K. With hard pressure mounts you should use less or you're risking to have it leaking in your socket pins.

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I'm just going to post the obligatory video

My System Specs: (Short list) i7 4770k, GTX 780, many SSD's, a 2 TB HDD(deceased :( ), Corsair 650D. Full list: http://pcpartpicker.com/user/kchriz6097/saved/8dh7YJ


Upgrade Plan: Acquire some Black Noctuas then add 16 or 32GB of 2133MHz memory

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Some paste spread better than others, I'd just use the nt-h1 from noctua probably the easiest to work with. I used like half of what he used and it spreaded complety over my 3930K. With hard pressure mounts you should use less or you're risking to have it leaking in your socket pins.

I use slightly more than that and I sue NT-H1 aswell and it barely covered my CPU....

 

 

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I use slightly more than that and I sue NT-H1 aswell and it barely covered my CPU....

Doesn't surprise me; H100i crappy backplate and poor pressure. I ended up using more on lga1155 than on S2011 because of that. In the end you dont even need to have it covering your cpu complety, the die is much smaller than the hsp.

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Better to have enough than not enough. Most people put too much anyway so it's kind of the case of 'Less is more'.

 

I use slightly more than that and I sue NT-H1 aswell and it barely covered my CPU....

The paste should spread with pressure. How tight was the mount?

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It fairly tight, backplate was on properly. 

With the H100i?

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yep

That makes sense. It doesn't have as good of a mount as Noctua's SecuFirm2 which is what I'm using. 

If you ever need help with a build, read the following before posting: http://linustechtips.com/main/topic/3061-build-plan-thread-recommendations-please-read-before-posting/
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Is it better to have a little bit too much, or a little less then you should?

 

I'm going to have to reapply paste when I switch motherboards. I'm aware there are a few methods of applying paste, but I think I'm going to go with the pea method (pea shape, not pea sized I believe is the right way to do it).

 

I just wanted to double check here before I went through with it. Thanks!!

It is not pea shaped, it is pea size. and most of the time less is more when comes to TIM unless stated other wise by the manufacture. 

A water-cooled mid-tier gaming PC.

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