Fill / Flow Question

[Rufus_J_Teague]

I have a number of questions so hopefully one of you will be kind enough to help me out here.

 

My current build: https://pcpartpicker.com/b/pxdmP6

Waiting on an EKWB Vector plexi Block & Backplate for the EVGA RTX 3090 FTW3 Ultra.

 

My first question addresses a flow pattern,  I am trying to get fancy and do a boating/water themed build (I am a competitive sailor on a Andrews 77 raceboat).  As such I was hoping to do some creative water elements on the top of my P5 case (wall mounted) above the tempered glass.  

 

I bought a small 3"x3"x4" square acrylic res with 3 x g1/4 ports, two on one of the longer sides and a single on the bottom. My flow currently leaves my 480 rad and will fill this reservoir as shown. My question is whether or not given pressure, if the res will fill to the top (Ie forcing the existing gas at fill through the system), or if the air @ time of fill will keep the res from filling completely.  My idea with this project is to etch a lighthouse design onto this res, with a small blue uv light plugging the upper port to make the front lighthouse etching look like it has a blue light. 

 

My 2nd question regards my cooling features in general.  I currently have a TT Pacific 480mm rad with 64mm thickness set up in push pull with 4x TT Ring 120 Quad RGB Plus fans as push, with 4x TT Tough Fans set for pull.

 

Right now only the CPU is connected to the loop (damn EKWB taking forever with my block - and all I hear is bad news about their quality) and while my standing temps are in the 30s to low 40s, when I run Cinebench I get as high as low seventies.  Is my block making bad contact?  Am I in the normal range?  Is the 480 in push pull not enough for both the i9 10900k & the RTX 3090?  Seems like everybody here goes for 2-3x 360mm rads and I am wondering if I need to figure out how to side mount another rad onto this P5 Chassis & add fans.  If I were to do so, could I run the 2nd rad parallel to the current 480? Use the ports on the back side of the rad to the image above to just add the new rad to the loop?

 

Lots of qs I know, just looking for some advice.

 

https://i.imgur.com/iVsXaJB.mp4

 

 

[artisuke]

As I don't water cool, I can't make a comment on how it sounds. However, I can say that low 70s on a stress test is very good, especially for an i9. Also that PC looks sick man.

[Hairless Monkey Boy]

The water will fill up to the height of the exit hole. Tipping the case forward, so that hole is on top, will allow the air to escape, and that res to fill.

[airborne spoon]

why not just put another hole in the top of your res and use it as the fill hole? the only way that thing will fill all the way up is if you fill it while its tipped around to let the air escape. seems a lot easier to just fill it from the top of that block since its at the highest point anyway.