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I am working on my first custom water loop and i am now on the graphic card. And i was wondering if there where any benefits to adding thermal compound under the thermal pads for the ram and other components covered by pads. Or if this would just add another layer and decrease overall heat dispersion?

 

Thanks.

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It depends, EK recommends using it if you plan to dismantle the block more than 2-3 times a year. It also helps (quite a lot actually) with stock thermal pads since they usually have low electrical conductivity.

 

The best solution would be to get a higher grade of pads such as Fujipoly Extremes.

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