Jump to content
Search In
  • More options...
Find results that contain...
Find results in...

IC Diamond Thermal paste, Spread or pea/line type application?

 Share

 

I bought a cheap thermal paste with around 7 W/mK spec and it works for 1 week or so in its prime where my CPU does not throttle but soon after it starts to get very bad. I think this is partly because of over 90-95C temps under load.

 

And soon after I found out about thermal paste drying issue and finally decided to buy IC Diamond because it consists of very little liquid compared to other thermal pastes.
But because has less liquid, it is hard to apply and was wondering whether I should spread or do the normal Pea/Line application method?. I am considering spreading because of the exposed IHS in a laptop. I want to cover every bit of the surface.

But not sure since air pockets might be a problem given the dryness and hard to spread consistency. I do remember the famous "Whatever" conclusion of Lukes video where he compares different application methods but I think that test needs to be done rigorously with multiple types of thermal pastes and heatsink solutions to see or amplify the difference in the methods.

 

Any experienced advice is appreciated. 

 

EXTRA CONTEXT: I First considered "Thermal Grizzly Kyronaut" but soon found out it also had this drying issue and even Artic MX-4 was reported to dryout which i dont understand given the 8 year warranty. Even liquid metal has the drying issues. So out of all i thought IC diamond made best sense because of its composition.

 

Photo of the cpu 

EDIT: 

Specs

i7 4720hq

in clevo p650se chassis.

IMG_20181220_233529.jpg

IMG_20181220_233303.jpg

Link to comment
Share on other sites

Link to post
Share on other sites

Application method makes essentially zero difference on small die chips like Intel. That said, you didn’t bother to tell us your CPU...

My Build, v2.1 --- CPU: i7-8700K @ 5.2GHz/1.288v || MoBo: Asus ROG STRIX Z390-E Gaming || RAM: 4x4GB G.SKILL Ripjaws 4 2666 14-14-14-33 || Cooler: Custom Loop || GPU: EVGA GTX 1080 Ti SC Black, on water || PSU: EVGA G2 850W || Case: Corsair 450D || SSD: 850 Evo 250GB, Intel 660p 2TB || Storage: WD Blue 2TB || G502 & Glorious PCGR Fully Custom 80% Keyboard || MX34VQ, PG278Q, PB278Q

Audio --- Headphones: Massdrop x Sennheiser HD 6XX || Amp: Schiit Audio Magni 3 || DAC: Schiit Audio Modi 3 || Mic: Blue Yeti

 

[Under Construction]

 

My Truck --- 2002 F-350 7.3 Powerstroke || 6-speed

My Car --- 2006 Mustang GT || 5-speed || BBK LTs, O/R X, MBRP Cat-back || BBK Lowering Springs, LCAs || 2007 GT500 wheels w/ 245s/285s

 

The Experiment --- CPU: i5-3570K @ 4.0 GHz || MoBo: Asus P8Z77-V LK || RAM: 16GB Corsair 1600 4x4 || Cooler: CM Hyper 212 Evo || GPUs: Asus GTX 750 Ti, || PSU: Corsair TX750M Gold || Case: Thermaltake Core G21 TG || SSD: 840 Pro 128GB || HDD: Seagate Barracuda 2TB

 

R.I.P. Asus X99-A motherboard, April 2016 - October 2018, may you rest in peace. 5820K, if I ever buy you a new board, it'll be a good one.

Link to comment
Share on other sites

Link to post
Share on other sites

5 minutes ago, Cereal5 said:

Application method makes essentially zero difference on small die chips like Intel. That said, you didn’t bother to tell us your CPU...

its an i7 4720hq in clevo p650se chassis. Bought from sager. Sager NP8651. 
Single Fan above in the image is for the CPU.

Link to comment
Share on other sites

Link to post
Share on other sites

Just now, tinted said:

its an i7 4720hq in clevo p650se chassis. Bought from sager. Sager NP8651.

Well if you’re applying it to the bare die I would go with a line.

My Build, v2.1 --- CPU: i7-8700K @ 5.2GHz/1.288v || MoBo: Asus ROG STRIX Z390-E Gaming || RAM: 4x4GB G.SKILL Ripjaws 4 2666 14-14-14-33 || Cooler: Custom Loop || GPU: EVGA GTX 1080 Ti SC Black, on water || PSU: EVGA G2 850W || Case: Corsair 450D || SSD: 850 Evo 250GB, Intel 660p 2TB || Storage: WD Blue 2TB || G502 & Glorious PCGR Fully Custom 80% Keyboard || MX34VQ, PG278Q, PB278Q

Audio --- Headphones: Massdrop x Sennheiser HD 6XX || Amp: Schiit Audio Magni 3 || DAC: Schiit Audio Modi 3 || Mic: Blue Yeti

 

[Under Construction]

 

My Truck --- 2002 F-350 7.3 Powerstroke || 6-speed

My Car --- 2006 Mustang GT || 5-speed || BBK LTs, O/R X, MBRP Cat-back || BBK Lowering Springs, LCAs || 2007 GT500 wheels w/ 245s/285s

 

The Experiment --- CPU: i5-3570K @ 4.0 GHz || MoBo: Asus P8Z77-V LK || RAM: 16GB Corsair 1600 4x4 || Cooler: CM Hyper 212 Evo || GPUs: Asus GTX 750 Ti, || PSU: Corsair TX750M Gold || Case: Thermaltake Core G21 TG || SSD: 840 Pro 128GB || HDD: Seagate Barracuda 2TB

 

R.I.P. Asus X99-A motherboard, April 2016 - October 2018, may you rest in peace. 5820K, if I ever buy you a new board, it'll be a good one.

Link to comment
Share on other sites

Link to post
Share on other sites

4 minutes ago, Cereal5 said:

Well if you’re applying it to the bare die I would go with a line.

Ya, i am also inclined to line and since it is not electrically conductive, i can go little overboard. Not too much though. Will not have any bubbles and will probably have a completely covered cpu

Link to comment
Share on other sites

Link to post
Share on other sites

the only time you should manually spread the thermal paste is if you're doing liquid metal. everything else you can just do the pea for

🌲🌲🌲

Judge the product by its own merits, not by the Company that created it.

Link to comment
Share on other sites

Link to post
Share on other sites

Create an account or sign in to comment

You need to be a member in order to leave a comment

Create an account

Sign up for a new account in our community. It's easy!

Register a new account

Sign in

Already have an account? Sign in here.

Sign In Now
 Share


×