IC Diamond Thermal paste, Spread or pea/line type application?

[tinted]

 

I bought a cheap thermal paste with around 7 W/mK spec and it works for 1 week or so in its prime where my CPU does not throttle but soon after it starts to get very bad. I think this is partly because of over 90-95C temps under load.

 

And soon after I found out about thermal paste drying issue and finally decided to buy IC Diamond because it consists of very little liquid compared to other thermal pastes.
But because has less liquid, it is hard to apply and was wondering whether I should spread or do the normal Pea/Line application method?. I am considering spreading because of the exposed IHS in a laptop. I want to cover every bit of the surface.

But not sure since air pockets might be a problem given the dryness and hard to spread consistency. I do remember the famous "Whatever" conclusion of Lukes video where he compares different application methods but I think that test needs to be done rigorously with multiple types of thermal pastes and heatsink solutions to see or amplify the difference in the methods.

 

Any experienced advice is appreciated. 

 

EXTRA CONTEXT: I First considered "Thermal Grizzly Kyronaut" but soon found out it also had this drying issue and even Artic MX-4 was reported to dryout which i dont understand given the 8 year warranty. Even liquid metal has the drying issues. So out of all i thought IC diamond made best sense because of its composition.

 

Photo of the cpu 

EDIT: 

Specs

i7 4720hq

in clevo p650se chassis.

[Cereal5]

Application method makes essentially zero difference on small die chips like Intel. That said, you didn’t bother to tell us your CPU...

[tinted]

5 minutes ago, Cereal5 said:

Application method makes essentially zero difference on small die chips like Intel. That said, you didn’t bother to tell us your CPU...

its an i7 4720hq in clevo p650se chassis. Bought from sager. Sager NP8651. 
Single Fan above in the image is for the CPU.

[Cereal5]

Just now, tinted said:

its an i7 4720hq in clevo p650se chassis. Bought from sager. Sager NP8651.

Well if you’re applying it to the bare die I would go with a line.

[tinted]

4 minutes ago, Cereal5 said:

Well if you’re applying it to the bare die I would go with a line.

Ya, i am also inclined to line and since it is not electrically conductive, i can go little overboard. Not too much though. Will not have any bubbles and will probably have a completely covered cpu

[Arika]

the only time you should manually spread the thermal paste is if you're doing liquid metal. everything else you can just do the pea for