liquid metal OR

[STRESSMASTER]

I am looking at gettting a different conductive paste/liquid for my new 1600x R5. I seen the liquid metal videos but I was wondering if there is other products that do about the same like IC Diamond 24 Carat. idk if this does the same bbut ppl have stated it is the same or better. other options very welcome. I will be using a corsair H100i v1

[Skiiwee29]

You wont really see a difference between LM and IC Diamond or other high end pastes on a soldered chip like the Ryzen line up. LM is not worth it unless you Delid, which will almost certainly kill your chip due to the soldered nature. Its possible to do, but the rate of failure is extremely high. 

[STRESSMASTER]

5 minutes ago, Skiiwee29 said:

You wont really see a difference between LM and IC Diamond or other high end pastes on a soldered chip like the Ryzen line up. LM is not worth it unless you Delid, which will almost certainly kill your chip due to the soldered nature. Its possible to do, but the rate of failure is extremely high. 

I have my H100i currently on a FX-8130 and it is OC'd to 4.7 from 3.1 and temps stay around 54C on full load. This is with regular 3rd party paste. (not cheap not expensive) would I even see enough of a difference to warrant better paste?

[Skiiwee29]

Just now, STRESSMASTER said:

I have my H100i currently on a FX-8130 and it is OC'd to 4.7 from 3.1 and temps stay around 54C on full load. This is with regular 3rd party paste. (not cheap not expensive) would I even see enough of a difference to warrant better paste?

No, not on a soldered chip you wont. 

[STRESSMASTER]

3 minutes ago, Skiiwee29 said:

No, not on a soldered chip you wont. 

what do you mean by soldered chip? it isn't solder onto the mobo.

[STRESSMASTER]

BTW I'm using a  ASRock X370 Killer SLI/ac mobo for the 1600x R5 ryzen cpu. about what OC'ability do you think it may get? It is my first ryzen so idk the ranges or voltages yet 

7 minutes ago, Skiiwee29 said:

No, not on a soldered chip you wont. 

 

[tikker]

12 minutes ago, STRESSMASTER said:

what do you mean by soldered chip? it isn't solder onto the mobo.

He means the IHS (the metal plate you put the thermal paste on) is soldered to the CPU die instead of connected through paste like with most Intel CPUs.

[STRESSMASTER]

3 minutes ago, tikker said:

He means the IHS (the metal plate you put the thermal paste on) is soldered to the CPU die instead of connected through paste like with most Intel CPUs.

Thanks I didn't know that as I never de-lidded a cpu b4.

[Majestic]

If your package size is 315mm2, and your lid is something like... 1414mm2, theoretically that means if your TIM between the heatsink is atleast 0.22x (315/1414) that of the interface between the LID and DIE it shouldn't bottleneck. Solder is about 80-90 w/mk, so in theory you should see scaling up to 16-ish w/mk. But just get a decent 11-12 w/mk paste and not deal with the hassle of lapping the CPU and heatsink afterwards because they're damaged from the liquid metal.

 

LM is only really useful for delidding.

[STRESSMASTER]

4 minutes ago, Majestic said:

scaling up to 20 w/mk

what do you mean by this? If I am undestanding correct u r saying that in this package with solder i'd need paste that is at least 10 w/mk but no more than 20 w/mk?

[STRESSMASTER]

8 minutes ago, Majestic said:

If your package size is 315mm2, and your lid is something like... 1300mm2, theoretically that means if your TIM between the heatsink is atleast 0.24x (315/1300) that of the interface between the LID and DIE it shouldn't bottleneck. Solder is about 80-90 w/mk, so in theory you should see scaling up to 20 w/mk. But just get a decent 11-12 w/mk paste and not deal with the hassle of lapping the CPU and heatsink afterwards because they're damaged from the liquid metal.

 

LM is only really useful for delidding.

what do you mean by this? If I am understanding correct u r saying that in this package with solder i'd need paste that is at least 10 w/mk but no more than 20 w/mk?

 

Do you have any recommendations? 

[Majestic]

If this is all abra cadabra, just stick to regular paste my dude. Just make sure it's some 10-12 w/mk (with no metal additives like silver) and you should be fine.

[STRESSMASTER]

1 minute ago, Majestic said:

If this is all abra cadabra, just stick to regular paste my dude.

no I actually understand most of it. though I had to re-lookup w/mk (lol). I just didn't understand what you meant by scaling. If you can explain that than I understand all of it.

[Majestic]

1 minute ago, STRESSMASTER said:

no I actually understand most of it. though I had to re-lookup w/mk (lol). I just didn't understand what you meant by scaling. If you can explain that than I understand all of it.

if you have a object of 315mm2 that interfaces with an object of 1414mm2 at 80-90 w/mk, that means in order to not bottleneck the thermal transfer (in theory), your interface between the 1414mm2 lid of the CPU and the heatsink needs to be 315/1414 = 0.22 that of the solder (napkin maths). So that's about 16-18 w/mk for the paste. By scaling I mean, up to 16-18 w/mk, you should see measureable improvement between say a 5-> 8 -> 12 -> w/mk pastes. 

 

It's all theory though, and a crappy application of the paste can already ruin it. And I doubt the scaling between a good 10-12 w/mk paste and 16-18 theoretically would be measureable in real life. Again, as soon as you start using silver additive thermal paste or LM, you run the risk of shorting and you start creating corrosion (galvanic). 

[STRESSMASTER]

18 hours ago, Majestic said:

if you have a object of 315mm2 that interfaces with an object of 1414mm2 at 80-90 w/mk, that means in order to not bottleneck the thermal transfer (in theory), your interface between the 1414mm2 lid of the CPU and the heatsink needs to be 315/1414 = 0.22 that of the solder (napkin maths). So that's about 16-18 w/mk for the paste. By scaling I mean, up to 16-18 w/mk, you should see measureable improvement between say a 5-> 8 -> 12 -> w/mk pastes. 

 

It's all theory though, and a crappy application of the paste can already ruin it. And I doubt the scaling between a good 10-12 w/mk paste and 16-18 theoretically would be measureable in real life. Again, as soon as you start using silver additive thermal paste or LM, you run the risk of shorting and you start creating corrosion (galvanic). 

do you have a mid lvl paste and a 16-18 w/mk paste recommendation? I would love something that doesn't harden to much after a year if that's even possible.