Case & cooler upgrade.

[Gerald_The]

Hi All, 

 

I need some help upgrading my rig. 

 

I rebulit my pc as my MB died in my old case. A Zalman Z11. 

Current Set up

Asus z170 Pro Gaming MB

Intel i7 6700k oc to 4.7ghz @ 1.325 v

32gb Corsair Vengance RAM

2 x Asus Strix 970 in SLI

Samsung 850evo 250gb as main drive

3 x 2tb Drives for Photos and films and other assorted crap.

A blu-ray drive (yes i know its old but i still rip cds to flac when i get them)

Corasir h80i AIO Cooler. 

A Zalman Z11.

 

I want to upgrade my case to a Fractal Design R5 and the AIO to the Corsair H115. My current cooler cant keep the cpu cood enough when on full duty. Temps hitting 85-88 celsius. 

 

The questions i have are:-

Will the h115 fit? and whats the best placment for quiet perfmance? If i place the rad up top will it not let sound out? Will it cool effectively if placed at the front and can i still fit the drive cage if the rad is front mounted. 

Is there a better soloution? Better case, better cooler? Better fans?

I have about £300 to spend (about $300 at current exchange rate)

 

All help is greatly apprecited, please ask if i havnt given enough info. (This is my first self built rig)

[Aytex]

Get a NH-D15 instead

[VictorVig]

The R5 is a great choice and the H115 will fit no probleme in the top of the case.

[TidaLWaveZ]

Yes it will fit in the front or the top.

 

Temp shouldn't change significantly whether you put it on the front or the top.  I would put it on the front and leave the moduvents on the top closed personally.

[SmashinMachine]

I used h100i v2 and h115i with i7 6700k. The temps will always hit over 80°C. There are three reasons for this high temps

I recommend you a custom loop if you want to watercool your cpu. 
(1) Skylake is smaller then the older cpus. The 3rd and 4th Generation 22 nanometer Die, and the 5th and 6th Generation 14 nanometer Die have significantly less surface area in contact with the underside of the Integrated Heat Spreader (IHS), than the larger 2nd Generation 32 nanometer Die.

(2) 3rd through 6th Generation processors have more transistors packed into a smaller Die than 2nd Generation processors.

(3) 3rd through 6th Generation processors use Thermal Interface Material (TIM) between the top of the Die and the underside of the IHS. Solder, which has superior thermal transfer characteristics, was instead used in 2nd Generation and earlier processors, and is used in Intel's "High End Desktop Processors"
If you install Custom Loop Watercooling, don't be surprised if it is not sooo cooler.I have now custom cooling max temp 70-75°C @4.8ghz

 

 

[Sreno1]

Lower the voltage slightly and the temps will go down drastically. Unless you really see the difference between 4.5GHz and 4.7GHz..

[Gonio]

Take a NZXT Kraken X61 over the Corsair. Better performer and can also run more sillent. Put in top and make it exhaust since front is overall used as intake for cases.

[Gerald_The]

Thanks for all you input guys.