GTX 790

[bigwjack]

hello linustectips forum does anybody know when the 790 is comming out and if its will be 2x gk110 chips on the same board or will it be 2x gk 104 chips. 

[I'm Batman]

it will probably be 2xgk110 and i dont think anyone knows the realse date

[YellowDragon]

No way you can pack 2 GK 110 cores onto one PCB, the chips are too large physically and require a complex array of VRM to power them, there would not be enough room on a normal sized PCB or it would have to be extended to the point where it would be far too long for most cases.

[I'm Batman]

No way you can pack 2 GK 110 cores onto one PCB, the chips are too large physically and require a complex array of VRM to power them, there would not be enough room on a normal sized PCB or it would have to be extended to the point where it would be far too long for most cases.

wellthats what you think, tech makes everytin possible friend. :)

[Anubikai]

The 790 is entirely possible.....but dont expect it anytime soon......they still want to push as many titans and 780s off the shelf as possible.....

 

-Anubikai

[5tephenm1o5]

No way you can pack 2 GK 110 cores onto one PCB, the chips are too large physically and require a complex array of VRM to power them, there would not be enough room on a normal sized PCB or it would have to be extended to the point where it would be far too long for most cases.

they said the same about other gtx #90 card but tech advances things get smaller thats how it works 

[YellowDragon]

wellthats what you think, tech makes everytin possible friend. :)

no that's not what I think, that's what I know, there is not magical wand of technology, look at the power draw and heat generation of the Titan, the design spec is 250W for a dual slot cooler card, you would need with standard binned chips a thermal solution that could dissipate 550W+ for it to be viable, not even the Gigabyte Windforce X3 on the Titan can even come close to that lofty number, the HD 7990 Has a TDP of 375W and look how huge that card is with its triple fan design. The card would Have to be a triple slot card in order to come anywhere near dissipating that heat properly. not to mention power delivery circuity takes room and also generates heat, where are you going to put the extra VRM without extending the PCB to some absurdly long length? There is no market effective solution for standard binned GK 110 chips which are already cream of the crop chips, now if you bin them Higher it might be possible, however at what costs and what yields?

You would pay through the nose if the card was even possible, Im talking at a price of $2500 for the two specially binned Gk 110 cores that are able to take low voltages and have low TDP. Please reconise that Engineering is only viable when there is Business backing it up, this will not be possible to do in an economical manner, so it will not occur.

[YellowDragon]

they said the same about other gtx #90 card but tech advances things get smaller thats how it works 

Look at the power delivery differences between the GK 104 cores and the GK 110 cores as well as the TDP differences, go ahead and tell me how to do it. As for your statement you could not be more wrong, in processors the only way you can lower the power requirements is to A.  Shrink the die, or B. Change the architecture , considering they wont unveil a new architecture based on the GK 110 core the 790 is a pipe dream in all regards. GK 110 is the last in the kepler series, Maxwell is next. There is no magic that goes on behind the scenes, its hard science and math.

 Unless you get very highly binned chips and produce workable yields the 790 is not possible, considering its already a cream of the crop chip and the yields for the complex GK110 core are already low you can ell me where this goes. 

[I'm Batman]

no that's not what I think, that's what I know, there is not magical wand of technology, look at the power draw and heat generation of the Titan, the design spec is 250W for a dual slot cooler card, you would need with standard binned chips a thermal solution that could dissipate 550W+ for it to be viable, not even the Gigabyte Windforce X3 on the Titan can even come close to that lofty number, the HD 7990 Has a TDP of 375W and look how huge that card is with its triple fan design. The card would Have to be a triple slot card in order to come anywhere near dissipating that heat properly. not to mention power delivery circuity takes room and also generates heat, where are you going to put the extra VRM without extending the PCB to some absurdly long length? There is no market effective solution for standard binned GK 110 chips which are already cream of the crop chips, now if you bin them Higher it might be possible, however at what costs and what yields?

You would pay through the nose if the card was even possible, Im talking at a price of $2500 for the two specially binned Gk 110 cores that are able to take low voltages and have low TDP. Please reconise that Engineering is only viable when there is Business backing it up, this will not be possible to do in an economical manner, so it will not occur.

seriosly i didnt read all of that i know how these things work and what i learned from beign in this industry for 3 years is : nothing is impossible

[heineygoat]

No way you can pack 2 GK 110 cores onto one PCB, the chips are too large physically and require a complex array of VRM to power them, there would not be enough room on a normal sized PCB or it would have to be extended to the point where it would be far too long for most cases.

People probably would have said the same thing about the 690 man.

People probably would have said an 8 core cpu and 2 gigs of ram was impossible in a phone a few years ago.

Thats technology man.

[Saan Koneri]

no that's not what I think, that's what I know, there is not magical wand of technology, look at the power draw and heat generation of the Titan, the design spec is 250W for a dual slot cooler card, you would need with standard binned chips a thermal solution that could dissipate 550W+ for it to be viable, not even the Gigabyte Windforce X3 on the Titan can even come close to that lofty number, the HD 7990 Has a TDP of 375W and look how huge that card is with its triple fan design. The card would Have to be a triple slot card in order to come anywhere near dissipating that heat properly. not to mention power delivery circuity takes room and also generates heat, where are you going to put the extra VRM without extending the PCB to some absurdly long length? There is no market effective solution for standard binned GK 110 chips which are already cream of the crop chips, now if you bin them Higher it might be possible, however at what costs and what yields?

You would pay through the nose if the card was even possible, Im talking at a price of $2500 for the two specially binned Gk 110 cores that are able to take low voltages and have low TDP. Please reconise that Engineering is only viable when there is Business backing it up, this will not be possible to do in an economical manner, so it will not occur.

If that monster card somehow would see the light, 2 x 780 would be cheaper. I mean that "790" price tag would be insane.

Edited July 6, 2013 by Saan Koneri

[I'm Batman]

Look at the power delivery differences between the GK 104 cores and the GK 110 cores as well as the TDP differences, go ahead and tell me how to do it. As for your statement you could not be more wrong, in processors the only way you can lower the power requirements is to A.  Shrink the die, or B. Change the architecture , considering they wont unveil a new architecture based on the GK 110 core the 790 is a pipe dream in all regards. GK 110 is the last in the kepler series, Maxwell is next. There is no magic that goes on behind the scenes, its hard science and math.

 Unless you get very highly binned chips and produce workable yields the 790 is not possible, considering its already a cream of the crop chip and the yields for the complex GK110 core are already low you can ell me where this goes. 

knowing that is not your buisness its nVidia s job to make it possible and im sure they will .so calm your tits

[5tephenm1o5]

Look at the power delivery differences between the GK 104 cores and the GK 110 cores as well as the TDP differences, go ahead and tell me how to do it. As for your statement you could not be more wrong, in processors the only way you can lower the power requirements is to A.  Shrink the die, or B. Change the architecture , considering they wont unveil a new architecture based on the GK 110 core the 790 is a pipe dream in all regards. GK 110 is the last in the kepler series, Maxwell is next. There is no magic that goes on behind the scenes, its hard science and math.

 Unless you get very highly binned chips and produce workable yields the 790 is not possible, considering its already a cream of the crop chip and the yields for the complex GK110 core are already low you can ell me where this goes. 

i wont argue with you but remember everything can seem impossible until it happens it will eventually happen we both know that just wait and see

[5tephenm1o5]

knowing that is not your buisness its nVidia s job to make it possible and im sure they will .so calm your tits

batman is right

YellowDragon

[YellowDragon]

People probably would have said the same thing about the 690 man.

People probably would have said an 8 core cpu and 2 gigs of ram was impossible in a phone a few years ago.

Thats technology man.

They said it was impossible at the current level of fabrication methods, there is a difference. Also your analogy is completely wrong, for one reason they said the 8 core phone was impossible based on the current fabrication methods and processor architectures implemented. When were talking about a GTX 790 were are talking about KEPLER and only KEPLER, there is no change in the fabrication of the chip itself.  

[YellowDragon]

knowing that is not your buisness its nVidia s job to make it possible and im sure they will .so calm your tits

No its not, However I have been in the Computer field long enough to know that a business sole purpose of existence is to make money. 10nm processors are 100% possible at this time, however is it viable with Yields that can produce a profit, no , they would need to upgrade their fabs. TSMC and Global Foundries knows this and they set a release period of when they think the fab will be available, after all both Nvidia and AMD get their silicon from these two companies. The same rule applies you have to produce enough of a yield in order to properly bring a silicon chip product to market. 

[I'm Batman]

No its not, However I have been in the Computer field long enough to know that a business sole purpose of existence is to make money. 10nm processors are 100% possible at this time, however is it viable with Yields that can produce a profit, no , they would need to upgrade their fabs. TSMC and Global Foundries knows this and they set a release period of when they think the fab will be available, after all both Nvidia and AMD get their silicon from these two companies. The same rule applies you have to produce enough of a yield in order to properly bring a silicon chip product to market. 

ok if this is going to make you happy i will do it.

790 is not possible guys its not possible it will be too long even longer tham my di*k

[YellowDragon]

If that monster card somehow would see the light, 2 x 780 would be cheaper. I mean that "790" price tag would be insane.

 

Precisely, which is the exact reason why HD7990s are not selling, they are extremely high binned chips in order to fit into the 375W TDP. take an already premium cost GPU that has the cream of the crop chips such as the GTX 780 and bin them higher to get chips that operate at extremely low voltages and shove them onto the same PCB, this was the same strategy that they used for the 690 and the only reason it was possible is because the GK 104 chips had a really high yield. However GK 110 is already a low yield chip due to its complexity and take into account the TDP of a GTX 780 is 250W, compare this  to a 195W GTX  680 or a 210W HD 7970 and you can see why Im saying with standard binning that the card is impossible to do, the higher the TDP the more complex the cooling system has to be in order to keep the chip within operating temps. The theoretical maximum cooling potential of a standard length dual slot card according to spec is 250W, due to the fact the 780 is a longer card they can ink out the cooling performance they need. Unless you made the card an absurd length like 16-18inch you cant pack enough heatsinks in that form factor for cooling.

 

The GTX 690 itself has a TDP of 300W since the chips are underclocked and binned for voltages, so based on the standard TDPs of a 780 and the fact that the chip is physically larger you will face quite a challenge to say the least in the engineering, even if it might be possible the chances of such a card making it to market are slim to none or come in a price so astronomically high that its cheaper to buy 2 individual GTX 780s thus invalidating one of the very reasons for the card existence.

[Jaggsta]

found this not sure if its true but says Q3 2013 for $999. And Nvidia wants there Fastest Card Record Back which GTX 690 lost when they released HD 7990.

 

http://videocardz.com/nvidia/geforce-700/geforce-gtx-790

Edited July 6, 2013 by Jaggsta

[Anubikai]

That's rumoured spec......Nadia will not say anything about a 790 till they feel they have made enough from the 780 and titan. As soon as they even hint to it....people will just save up that little bit more for the 790 if and when it comes out. My guess is starting prices will be around the 1300 and the drop to 1000 dollars after a couple of months.

-Anubikai

[brownninja97]

No way you can pack 2 GK 110 cores onto one PCB, the chips are too large physically and require a complex array of VRM to power them, there would not be enough room on a normal sized PCB or it would have to be extended to the point where it would be far too long for most cases.

Tooooo bad. They will work something out im sure or it will be a gtx785 with two gk104s but that would be bad and you know why. The pcb will be wider but I dont think thats much of a problem and if people want extreme performance then they need to buck up.