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Hey guys,

 

Got an interesting idea, what would happen if you created a full vacuum around a water-cooled system, and allowed heat dissipation to occur external. 

Know it sounds mad, but the Thermaltake The Tower 900 is where the idea comes from, if you could seal the front chamber, allowing pass-through to the rear radiators and fans.

The idea is I hope it will help with the efficiency of the water-cooling loop, as heat cannot be dissipated from the motherboard etc. this would cause a higher heat gradient for the radiators as the water-cooling would be absorbing more heat from direct contacts i.e. CPU & GPU, or extra if the motherboard is something like the Asus Maximus IX Extreme.

Just a weird experiment that seemed up LTT street.

Would be interesting to hear other peoples opinions and theories.

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2 hours ago, ACole said:

-Would be interesting to hear other peoples opinions and theories.

You'd have to watercool EVERYTHING (VRM, RAM, chipset) since these still need airflow for cooling normally. Also It would be almost impossible to achieve a seal since I/o ports on the motherboard and graphics cards will be leaky. And assuming all this to work all you get is a hotter system, since the transfer efficiency between the heat generating component and block is not increased, so all you are getting is hotter components that is ultimately putting more strain on the watercooling loop. My opinion: bad idea.

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Have you worked with a Tower 900?  To seal the two chambers off from one another would be quite a feat in and of itself.  They are heavily interconnected with hundreds of holes.  

 

And as noted, the lack of airflow across other components would just create hotter components.  That doesn't mean anything would transfer heat any better.  I mean I'm already cooling my VRM with a monoblock in a Tower 900, but my NVMe SSD gets pretty toasty with the airflow it currently has, let alone my ram or chipset. 

Ryzen 7 2700X , Asus Prime X570-Pro, Bykski CPU Block, AMD Vega 56, Barrow GPU block, g.Skill Ripjaws V 32GB PC2800, Dual EKWB SE360 Radiators, Corsair RM750x PSU. All in a Lian-Li PC011 Dynamic XL case.

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