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I have an idea for my next build to be made in a Nintendo entertainment system shell.  So far, I know I can fit a mini ITX board in with a Flex ATX power supply.  I would be mounting the mobo upside down for space reasons.  I would be mounting (somehow) the SSD and another 2.5" HDD to the top of the NES.  It's already pretty packed in there, but if I did my math right, I can put in a GTX 1060 mini in there somehow.  The only question then is how would I do that so that there is still ample airflow throughout the system.  Any thoughts on this?

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It would be impossible to cool your components properly without drilling a few holes

 

Here's an atom NES build that you might want to look at

http://www.retrocollect.com/forum/viewtopic.php?p=22134

Desktop: i7-6700K / Asus Z170 S / H100i V2 / LPX 2400Mhz 16GB / 960 EVO 250GB / 2x 860 EVO 500GB / RM750i  / NZXT H440 XB271H + Z22n Monitors

Laptop: Thinkpad T450s / i7-5600U / 12GB / 860 EVO 500GB

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9 minutes ago, Ernest_L said:

It would be impossible to cool your components properly without drilling a few holes

Fortunately, a user here came up with a pleasant looking solution.

 

 

if you have to insist you think for yourself, i'm not going to believe you.

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