Won't backside power delivery affect cooling?

[Gat Pelsinger]

It is rumored that a few SKUs of Arrow Lake are going to come with the backside power delivery feature where instead of routing both the data and power lines on top of the transistor (front side), the power lines are going to be routed from below the transistor (back side). This is supposed to greatly improve stability and give more overclocking potential as the interference between the data and power lines is a major problem. 

 

When you de-lid your processor, the die you see is the backside of the chip, so the transistors are completely exposed and all the data and power lines are beneath inside the chip, so it becomes easier too cool the transistors. But when we switch to backside power delivery, won't the power lines be on top of the transistor and be harder to cool it?

 

I mean some presentations by Intel do say the cons of PowerVia (Intel's naming for backside power delivery) that heat dissipation might be a problem.