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I'm not 100% sure yet, but I think I'm going to delid my 10900k with rockitcool delidding tool. In fact, I plan on doing the direct die cooling as well. 

My quesiton is, how much of a difference would conductonaut make here compared to kryonaut?

I saw gamer nexus recommend using normal paste with direct die.

To quote them, they said: "If you're direct die mounting and eliminating the IHS, it's best to use a good thermal paste (not LM) for long-term viability and for peak performance. LM is good, but delta is minimal vs. paste in direct die. What most people don't understand is that the biggest improvement from delidding and re-lidding w/ liquid metal isn't from the liquid metal itself, but rather the removal of a layer of silicone adhesive and thus an air gap die-to-IHS. LM helps a lot, but isn't everything." Is that true? Again, how many degrees (°C) would the difference be between the two (kryonaut and conductonaut) on direct die?

I don't think I can use conductonaut with direct die because I'll probably switch to kraken z73 which has a copper coldplate, not nickel, plus it's really risky since it's conductive. Also, I saw a video on youtube where some guy couldn't get a proper contact between arctic lf2 and cpu die, and he was using the same rockitcool's direct die frame. Could it have the same issue with kraken z73?

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