GPU thermal paste change.. HELP.

[Mahbub]

I am soon going to change the thermal paste in my gtx 1080 amp extreme.. i am nervous as to which method amd how much to use in order to cover full gpu dye but not overuse.. is spreading with a small plastic tool better? Or just a blob in the middle.. also if after reassembly the paste inside dosnt touch the while die amd some corer gets left out.. what happens?

[Semper]

When it comes to GPU's TIM swap, I subscribe to the "excess is fine (within reason), if you don't know what you're doing" method. So long as you're not using a conductive TIM (ergo, anything modern that isn't gallium based/liquid metal should be non conductive), a bit of overflow excess shouldn't be a problem beyond being a bit messy.
You can absolutely spread it over the die if you'd like.

Should your replacement TIM fail to spread out across your entire die it can (likely will) create a hotspot that will eventually cause the card to fail.

[Dedayog]

Is there a reason you're changing the paste?  You seem nervous about it and while I am all for doing and learning, they're not a maintenance item.  Paste is still good for years.

[Mahbub]

3 minutes ago, Semper said:

When it comes to GPU's TIM swap, I subscribe to the "excess is fine, if you don't know what you're doing" method. So long as you're not using a conductive TIM (ergo, anything modern that isn't gallium based/liquid metal), a bit of overflow excess shouldn't be a problem beyond being a bit messy.
You can absolutely spread it over the die if you'd like.

Should your replacement TIM fail to spread out across your entire die it can (likely will) create a hotspot that will eventually cause the card to fail.

Some posts are saying spreading air bubbles etc etc.. aur bubbles van also cause hotspots right?

 

[Mahbub]

3 minutes ago, jstudrawa said:

Is there a reason you're changing the paste?  You seem nervous about it and while I am all for doing and learning, they're not a maintenance item.  Paste is still good for years.

The card is running hot.. and i wanna put in a better compound for some gains

[Semper]

8 minutes ago, Mahbub said:

Some posts are saying spreading air bubbles etc etc.. aur bubbles van also cause hotspots right?

 

 

7 minutes ago, Mahbub said:

The card is running hot.. and i wanna put in a better compound for some gains

Theoretically, yes. Air bubbles have never been an issue in any of my experiences however. I don't know that I've ever read of issues relating to air bubbles either.
If air bubbles cause an issue, it's likely that you didn't have adequate mounting pressure as a precursor.

a 10xx series card shouldn't be having issues with TIM this early. It may be a limitation of your cooler design, your environment, or the airflow in your case, in which event a TIM swap likely won't see any improvement. Before you pull the card apart, do some research on your card, see if it's a known issue. Also assess your airflow, see if that can be improved (a quick and dirty way to check this would be to remove your side panel and run as you would normally, see if there's any improvement.

[Mahbub]

7 minutes ago, Semper said:

 

Theoretically, yes. Air bubbles have never been an issue in any of my experiences however. I don't know that I've ever read of issues relating to air bubbles either.
If air bubbles cause an issue, it's likely that you didn't have adequate mounting pressure as a precursor.

a 10xx series card shouldn't be having issues with TIM this early. It may be a limitation of your cooler design, your environment, or the airflow in your case, in which event a TIM swap likely won't see any improvement. Before you pull the card apart, do some research on your card, see if it's a known issue. Also assess your airflow, see if that can be improved (a quick and dirty way to check this would be to remove your side panel and run as you would normally, see if there's any improvement.

Okk will try.. but in case if i change.   Should i go for spreading method? Should i freak abt air bubbles if i change tim and use zoread methid.. because to be using the drop method and having a part of the die left out sounds a bigger problem

[Semper]

5 minutes ago, Mahbub said:

Okk will try.. but in case if i change.   Should i go for spreading method? Should i freak abt air bubbles if i change tim and use zoread methid.. because to be using the drop method and having a part of the die left out sounds a bigger problem

I get the impression that no matter what I say here, you're going to be concerned that you've done it incorrectly.
Pick a method and go with it, don't be unreasonable with how much (or how little) you apply, and trust yourself.

Again though, do some research and/or check your case airflow before you pull your card out.

[Mahbub]

11 minutes ago, Semper said:

I get the impression that no matter what I say here, you're going to be concerned that you've done it incorrectly.
Pick a method and go with it, don't be unreasonable with how much (or how little) you apply, and trust yourself.

Again though, do some research and/or check your case airflow before you pull your card out.

Okk tell me personally which method u would go with.. ?

[Semper]

5 minutes ago, Mahbub said:

Okk tell me personally which method u would go with.. ?

So long as you have enough TIM, application method makes no difference. Pick one and roll with it. I use the dot/pea method because I'm lazy, but I've also been doing this long enough that I can reasonably estimate how much is needed.
When I first started, I spread it with a tool. When I lost the tool, I used my fingers.
When I got a little more lazy, I moved to the "X" method.
When I got even more lazy, I arrived at the dot/pea method.