3D Processors - Best Cooling Method

[NetherRealm]

Intel Architecture Day 2018

So we can see that Intel has started work on 3D processor technology. I say that their cooling methods provided for these processors will be sub optimal (go figure)...

 

In the future I envision, I see MASSIVE CPUs and GPUs doing who knows what in ordinary desktop computers and servers alike... I don't mean large like Threadripper, I mean take threadripper, make it TALLER...

 

Cooling a CPU like this wouldn't be easy, and overheating would probably occur quite often in the center of a large CPU block( I will be referring to my hypothetical CPU as a block because a chip isn't really what I envision, and for what I imagine it is much more accurate).

 

My suggestion: CPU Block Integrated Liquid Cooling. (Don't bother with that as an acronym.)

 

 

Current CPU chips are flat and really only have 1 surface for cooling; when you extend a CPU upwards and add more cores or whatever you need to make sure that it is properly cooled so that it doesn't get too hot, overheat and die.

 

 

The old method of cooling would require a heatsink on the surface of a CPU to cool it, to adequately cool a CPU block you will need to add more surface area for a cooler to make contact, which I see is just wasted extra space.

 

It is quite likely likely that there will be some sort of heatpipe to take the heat away from the CPU block dies and move that up to the top so that old cooling is still an option... I see that as a waste of time,and a waste of possibilities.

 

If you want to make your future 3D processors go really fast, you would integrate a superior cooling method directly into the CPU, but allow for some flexibility... don't put a pump, reservoir or fan onto the CPU, just leave the connections for the users to connect the system how they want, allow for aesthetics, and maybe, include a decent cooler with the processor...

 

 

 

What are your thoughts opinions or questions on this topic? Any points I missed? Let me know below!

[Enderman]

1) This is the same concept as 3D stacked nand. Go look at a samsung SSD, the chips are still flat and can be cooled normally. They do not turn into 3d cubes.

 

2) Adding surface area to a CPU for the cooler to make contact is not a waste of space. Water and air have very low thermal conductivity so in order to properly transfer thermal energy to the air or water there need to be fins, and those finds need to be attached to copper or aluminum for high thermal conductivity.

 

3) CPUs are getting more and more efficient every year, so even though processing power goes up the heat still goes down.

 

4) it is impossible to put a pump, reservoir, and fan into a CPU, you need physical size for those components much larger than a CPU.

 

5) CPU coolers are not included with high end processors for a reason. It is a waste to include a cooler with them, and it just increases the price.

[Droidbot]

if it's a little bit taller, shape the IHS around the chip so that the cooler only has to cool one surface but the entire die can be cooled.

simple and remains compatible with most coolers.

[Phentos]

2 hours ago, Droidbot said:

if it's a little bit taller, shape the IHS around the chip so that the cooler only has to cool one surface but the entire die can be cooled.

simple and remains compatible with most coolers.

Or they could just go to town with the toothpaste application 

[Droidbot]

6 minutes ago, Phentos said:

Or they could just go to town with the toothpaste application 

at the cost of thermal conductivity, as the toothpaste doesn't conduct as much to the substrate as the solder/IHS does

[Phentos]

2 minutes ago, Droidbot said:

at the cost of thermal conductivity, as the toothpaste doesn't conduct as much to the substrate as the solder/IHS does

I was joking.

[Droidbot]

Just now, Phentos said:

I was joking.

fr though I can see Intel doing that if it is actually taller

 

I mean they released Kaby Lake-X they hit peak dumb

[Phentos]

13 minutes ago, Droidbot said:

Kaby Lake-X

I don't think Intel will ever be able to top that one.