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3D Processors - Best Cooling Method

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Intel Architecture Day 2018

So we can see that Intel has started work on 3D processor technology. I say that their cooling methods provided for these processors will be sub optimal (go figure)...

 

In the future I envision, I see MASSIVE CPUs and GPUs doing who knows what in ordinary desktop computers and servers alike... I don't mean large like Threadripper, I mean take threadripper, make it TALLER...

 

Cooling a CPU like this wouldn't be easy, and overheating would probably occur quite often in the center of a large CPU block( I will be referring to my hypothetical CPU as a block because a chip isn't really what I envision, and for what I imagine it is much more accurate).

 

My suggestion: CPU Block Integrated Liquid Cooling. (Don't bother with that as an acronym.)

 

 

Current CPU chips are flat and really only have 1 surface for cooling; when you extend a CPU upwards and add more cores or whatever you need to make sure that it is properly cooled so that it doesn't get too hot, overheat and die.

 

 

The old method of cooling would require a heatsink on the surface of a CPU to cool it, to adequately cool a CPU block you will need to add more surface area for a cooler to make contact, which I see is just wasted extra space.

 

It is quite likely likely that there will be some sort of heatpipe to take the heat away from the CPU block dies and move that up to the top so that old cooling is still an option... I see that as a waste of time,and a waste of possibilities.

 

If you want to make your future 3D processors go really fast, you would integrate a superior cooling method directly into the CPU, but allow for some flexibility... don't put a pump, reservoir or fan onto the CPU, just leave the connections for the users to connect the system how they want, allow for aesthetics, and maybe, include a decent cooler with the processor...

 

 

 

What are your thoughts opinions or questions on this topic? Any points I missed? Let me know below!

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1) This is the same concept as 3D stacked nand. Go look at a samsung SSD, the chips are still flat and can be cooled normally. They do not turn into 3d cubes.

 

2) Adding surface area to a CPU for the cooler to make contact is not a waste of space. Water and air have very low thermal conductivity so in order to properly transfer thermal energy to the air or water there need to be fins, and those finds need to be attached to copper or aluminum for high thermal conductivity.

 

3) CPUs are getting more and more efficient every year, so even though processing power goes up the heat still goes down.

 

4) it is impossible to put a pump, reservoir, and fan into a CPU, you need physical size for those components much larger than a CPU.

 

5) CPU coolers are not included with high end processors for a reason. It is a waste to include a cooler with them, and it just increases the price.

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if it's a little bit taller, shape the IHS around the chip so that the cooler only has to cool one surface but the entire die can be cooled.

simple and remains compatible with most coolers.

If I helped, hit the thumbs up icon below my post and pick it as 'Best Answer'

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2 hours ago, Droidbot said:

if it's a little bit taller, shape the IHS around the chip so that the cooler only has to cool one surface but the entire die can be cooled.

simple and remains compatible with most coolers.

Or they could just go to town with the toothpaste application ?

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6 minutes ago, Phentos said:

Or they could just go to town with the toothpaste application ?

at the cost of thermal conductivity, as the toothpaste doesn't conduct as much to the substrate as the solder/IHS does

If I helped, hit the thumbs up icon below my post and pick it as 'Best Answer'

Resident living meme - I swear a lot; if you don't like it fuck off :^)

  My specs and shit down below.

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Apollo: i5 4670K @ 4.6Ghz, Corsair H100i, MSI Z87I, EVGA GTX 1070 SC ACX3, Corsair 250D, 840 EVO 120GB, 1TB Seagate Barracuda, SeaSonic 520W PSU. Planned upgrades: 16GB RAM, 480/512GB SSD, new HDD

Sputnik: HP EliteBook 2570p, i5-3360M, 16GB DDR3, 256GB 840 EVO - Running Win10/Sierra dual-boot.  Future upgrades: i7-quad

Comet (home server): Atom D2500, 4GB 1066Mhz RAM, 2 x 320GB HDDs, 350W PSU, HAF-Stacker ITX, dual GbE. Cost me $80. back from the dead (mobo failure) bois

Spoiler

Main peripherals

- Corsair Strafe RGB MX Reds

- SteelSeries Siberia 650

- SteelSeries QcK+ CS:GO Camo 

- SteelSeries QcK+ Na'Vi Splash (Secondary pad, used for second rig)

- SteelSeries Rival 700

- SteelSeries Rival 300 (Secondary mouse, used for second rig)

 

 

 

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2 minutes ago, Droidbot said:

at the cost of thermal conductivity, as the toothpaste doesn't conduct as much to the substrate as the solder/IHS does

I was joking.

New Build (The Compromise): CPU - i7 9700K @ 5.1Ghz Mobo - ASRock Z390 Taichi | RAM - 16GB G.SKILL TridentZ RGB 3200CL14 @ 3466 14-14-14-30 1T | GPU - ASUS Strix GTX 1080 TI | Cooler - Corsair h100i Pro | SSDs - 500 GB 960 EVO + 500 GB 850 EVO + 1TB MX300 | Case - Coolermaster H500 | PSUEVGA 850 P2 | Monitor - LG 32GK850G-B 144hz 1440p | OSWindows 10 Pro. 

Peripherals - Corsair K70 Lux RGB | Corsair Scimitar RGB | Audio-technica ATH M50X + Antlion Modmic 5 |

CPU/GPU history: Athlon 6000+/HD4850 > i7 2600k/GTX 580, R9 390, R9 Fury > i7 7700K/R9 Fury, 1080TI > Ryzen 1700/1080TI > i7 9700K/1080TI.

Other tech: Surface Pro 4 (i5/128GB), Lenovo Ideapad Y510P w/ Kali, OnePlus 6T (8G/128G), PS4 Slim.

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Just now, Phentos said:

I was joking.

fr though I can see Intel doing that if it is actually taller

 

I mean they released Kaby Lake-X they hit peak dumb

If I helped, hit the thumbs up icon below my post and pick it as 'Best Answer'

Resident living meme - I swear a lot; if you don't like it fuck off :^)

  My specs and shit down below.

Spoiler

Apollo: i5 4670K @ 4.6Ghz, Corsair H100i, MSI Z87I, EVGA GTX 1070 SC ACX3, Corsair 250D, 840 EVO 120GB, 1TB Seagate Barracuda, SeaSonic 520W PSU. Planned upgrades: 16GB RAM, 480/512GB SSD, new HDD

Sputnik: HP EliteBook 2570p, i5-3360M, 16GB DDR3, 256GB 840 EVO - Running Win10/Sierra dual-boot.  Future upgrades: i7-quad

Comet (home server): Atom D2500, 4GB 1066Mhz RAM, 2 x 320GB HDDs, 350W PSU, HAF-Stacker ITX, dual GbE. Cost me $80. back from the dead (mobo failure) bois

Spoiler

Main peripherals

- Corsair Strafe RGB MX Reds

- SteelSeries Siberia 650

- SteelSeries QcK+ CS:GO Camo 

- SteelSeries QcK+ Na'Vi Splash (Secondary pad, used for second rig)

- SteelSeries Rival 700

- SteelSeries Rival 300 (Secondary mouse, used for second rig)

 

 

 

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13 minutes ago, Droidbot said:

Kaby Lake-X

I don't think Intel will ever be able to top that one. 

New Build (The Compromise): CPU - i7 9700K @ 5.1Ghz Mobo - ASRock Z390 Taichi | RAM - 16GB G.SKILL TridentZ RGB 3200CL14 @ 3466 14-14-14-30 1T | GPU - ASUS Strix GTX 1080 TI | Cooler - Corsair h100i Pro | SSDs - 500 GB 960 EVO + 500 GB 850 EVO + 1TB MX300 | Case - Coolermaster H500 | PSUEVGA 850 P2 | Monitor - LG 32GK850G-B 144hz 1440p | OSWindows 10 Pro. 

Peripherals - Corsair K70 Lux RGB | Corsair Scimitar RGB | Audio-technica ATH M50X + Antlion Modmic 5 |

CPU/GPU history: Athlon 6000+/HD4850 > i7 2600k/GTX 580, R9 390, R9 Fury > i7 7700K/R9 Fury, 1080TI > Ryzen 1700/1080TI > i7 9700K/1080TI.

Other tech: Surface Pro 4 (i5/128GB), Lenovo Ideapad Y510P w/ Kali, OnePlus 6T (8G/128G), PS4 Slim.

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