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About Thermal compound..

Theres a few method of applying

One line,cross method and a grain of rice method.

None of them actually fully covers the cpu,so is full coverage important?

If so,anyone here knows the proper way to achieve full coverage without leaking the compound onto the mobo?

“It would seem that Our Lord finds our desires not too strong, but too weak. We are half-hearted creatures, fooling about with drink and sex and ambition when infinite joy is offered us, like an ignorant child who wants to go on making mud pies in a slum because he cannot imagine what is meant by the offer of a holiday at the sea. We are far too easily pleased.”


 


―  C.S. Lewis  :)

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In theory, any volume of paste greater than the sum of micro-divits and dents in the surfaces of the CPU and the cooler will squeeze out assuming sufficient pressure, so the answer might just be push harder (but not too hard - don't break the motherboard like some people do... 3 times ;))

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The "X" method is the most thermally effective. 

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In theory, any volume of paste greater than the sum of micro-divits and dents in the surfaces of the CPU and the cooler will squeeze out assuming sufficient pressure, so the answer might just be push harder (but not too hard - don't break the motherboard like some people do... 3 times ;))

 

I'm digging the LTT reference.

Intel Core i7-6700K | Corsair H105 | Asus Z170I PRO GAMING | G.Skill TridentZ Series 16GB | 950 PRO 512GB M.2

 

Asus GeForce GTX 980 Ti 6GB STRIX OC | BitFenix Prodigy (Black/Red) | XFX PRO Black Edition 850W

 

 

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The "X" method is the most thermally effective.

Any way i can do full coverage.. maybe add a line or smt? xD

If i leak to the mobo it wont break or will it?

“It would seem that Our Lord finds our desires not too strong, but too weak. We are half-hearted creatures, fooling about with drink and sex and ambition when infinite joy is offered us, like an ignorant child who wants to go on making mud pies in a slum because he cannot imagine what is meant by the offer of a holiday at the sea. We are far too easily pleased.”


 


―  C.S. Lewis  :)

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In theory, any volume of paste greater than the sum of micro-divits and dents in the surfaces of the CPU and the cooler will squeeze out assuming sufficient pressure, so the answer might just be push harder (but not too hard - don't break the motherboard like some people do... 3 times ;))

Linus too ghetto

“It would seem that Our Lord finds our desires not too strong, but too weak. We are half-hearted creatures, fooling about with drink and sex and ambition when infinite joy is offered us, like an ignorant child who wants to go on making mud pies in a slum because he cannot imagine what is meant by the offer of a holiday at the sea. We are far too easily pleased.”


 


―  C.S. Lewis  :)

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Any way i can do full coverage.. maybe add a line or smt? xD

If i leak to the mobo it wont break or will it?

 

Nope. X is best: https://www.pugetsystems.com/labs/articles/Thermal-Paste-Application-Techniques-170/

 

post-233981-0-65749700-1444334450_thumb.

Intel Core i7-6700K | Corsair H105 | Asus Z170I PRO GAMING | G.Skill TridentZ Series 16GB | 950 PRO 512GB M.2

 

Asus GeForce GTX 980 Ti 6GB STRIX OC | BitFenix Prodigy (Black/Red) | XFX PRO Black Edition 850W

 

 

My BuildPCPartPicker | CoC

 

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Any way i can do full coverage.. maybe add a line or smt? xD

If i leak to the mobo it wont break or will it?

tim is a pain in the rear to get off a motherboard when you put too much on... you really dont need to put that much intel small grain of rice, amd a line down the center. the heat sink will spread out the tim, you dont need to cover the whole thing 

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“It would seem that Our Lord finds our desires not too strong, but too weak. We are half-hearted creatures, fooling about with drink and sex and ambition when infinite joy is offered us, like an ignorant child who wants to go on making mud pies in a slum because he cannot imagine what is meant by the offer of a holiday at the sea. We are far too easily pleased.”


 


―  C.S. Lewis  :)

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DAFUQ happy face lol

 

Yeah. 

 

post-233981-0-50744600-1444334647.jpg

 

It actually did fairly well.

Intel Core i7-6700K | Corsair H105 | Asus Z170I PRO GAMING | G.Skill TridentZ Series 16GB | 950 PRO 512GB M.2

 

Asus GeForce GTX 980 Ti 6GB STRIX OC | BitFenix Prodigy (Black/Red) | XFX PRO Black Edition 850W

 

 

My BuildPCPartPicker | CoC

 

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