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hey guys i delidded my 8700k today, put thermal grizzly conductonaut on it, applied enough and there was no pooling, my temps on an h80 are 35 degrees celcius idle, and overclocked to 5ghz on prime95 it instantly jumps to 90-100.. did i do something wrong? i didnt reglue the ihs, i have enough thermal paste on the ihs, maybe too little conductonaut on the cpu die? or are temps normal? o.O

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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1 hour ago, Flowroro said:

hey guys i delidded my 8700k today, put thermal grizzly conductonaut on it, applied enough and there was no pooling, my temps on an h80 are 35 degrees celcius idle, and overclocked to 5ghz on prime95 it instantly jumps to 90-100.. did i do something wrong? i didnt reglue the ihs, i have enough thermal paste on the ihs, maybe too little conductonaut on the cpu die? or are temps normal? o.O

That depends on what you're using to cool it.

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everythings stock settings, didnt reseal the ihs, just seated it and clamped by motherboard.

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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2 hours ago, Flowroro said:

everythings stock settings, didnt reseal the ihs, just seated it and clamped by motherboard.

It could be that the ihs doesn't make perfect contact with the die, so as soon as you ramp up usage the increased temps aren't efficiently dissipated to the cooler. 

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the pump i think is working, i can hear the liquid moving when my pc starts up, the tubes are vibrating a bit too?

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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what about if i covered too much area with liquid metal on the ihs? would that affect temps?

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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I think you are going to need to upgrade your cooling solution TBH. That chip runs hot and since you delidded it that means it will be better at moving heat from the CPU to the cooling solution.

 

I know you can use the cpu mechanism to keep the IHS on, but I have always preferred to re-glue it. I would use RTV Gasket maker instead of super glue. Just make sure to leave that a 1/4" area around it without adhesive.

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13 minutes ago, Flowroro said:

what about if i covered too much area with liquid metal on the ihs? would that affect temps?

yes, the amount of compound on the CPU shouldn't be bigger than a drop, otherwise it could just move to the sides when you apply pressure on it and you don't want that

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9 minutes ago, aezakmi said:

yes, the amount of compound on the CPU shouldn't be bigger than a drop, otherwise it could just move to the sides when you apply pressure on it and you don't want that

Actually the liquid metal needs to be spread on there with the provided applicator in a REALLY thin coating.

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yea i have the correct amount, but the surface area covered is a bit bigger, like the die size of a 7900x, would that affect performance? so imagine the cpu die is a rectangle, i have both sides (ihs and cpu die perfectly spreaded and just enough applied) but the ihs surface area is like a square?

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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Just now, AngryBeaver said:

Actually the liquid metal needs to be spread on there with the provided applicator in a REALLY thin coating.

i spread it thinly on the ihs and the cpu die, but on my ihs i spread more surface area, same thinness, would that impact performance?

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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3 minutes ago, Flowroro said:

i spread it thinly on the ihs and the cpu die, but on my ihs i spread more surface area, same thinness, would that impact performance?

It should be fine, the key is good coverage. Being liquid the excess is going to be pushed out the sides (which is a short risk as it IS conductive.)

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Just now, AngryBeaver said:

It should be fine, the key is good coverage. Being liquid the excess is going to be pushed out the sides (which is a short risk as it IS conductive.)

heres a pic for reference, both sides are quite thin, no blobbing

liquid.png

CPU: Intel i7 8700k || Motherboard: Asus Z370-E ROG || RAMCorsair 4266 2x8gb || GPU: Sapphire r9 280x tri-x || Case: Corsair 780t || 

Storage: Samsung 850 Evo 250GB, 1TB Segate Barracuda HDD || PSUSeasonic M12II Evo 850w || Display: AOC i2367FH 1920x1080p 23 Inch ||

CPU Cooler: Corsair h80 || KeyboardCorsair Strafe || MouseCorsair Scimitar || HeadsetHyper X Cloud II || OS: Windows 10 ||

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10 minutes ago, Flowroro said:

heres a pic for reference, both sides are quite thin, no blobbing

liquid.png

I think what you are trying to tell me is you painted a larger area on the IHS than the actual size of the DIE.

 

I personally would have no recommended that as you don't want it dripping on your cpu's PCB. If you painted over the contacts on top with either nail polish or liquid electrical tape then you are probably fine, but you don't want the liquid metal to drip on the PCB and cause a short if it contacts a connection.

 

I only paint the die with it because of the issue above, but if I was going to paint both sides I would get a dry erase marker and completely cover the die with it... then position the IHS and push down on it firmly enough to transfer the ink... then you can use something sharp on the ihs to mark your die location and paint it with Liquid metal too.

 

Generally when you delid you would have wanted to mark the die location before you cleaned the TIM off.

 

This all assumes you can get the IHS placement perfect. If you are using a tool then you should be fine... however, if you are old school and use a thin razor like me... then it requires a much more finesse 

 

 

However, this is not going to be the cause of your temp issue.

 

You are probably either hitting the thermal limits of what your cooler can dissipate or your voltages are much higher than are needed. Probably a combination of both.

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