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Hi,

 

So yesterday I did a build, and everything assembly wise seemed to go ok as I have a working system as far as I can tell. However during the thermal paste application I am not certain if all the paste went where it should go, when i was spreading the paste over the IHS some I recall got down the side of it, along the little PCB "rim", I noticed there was a surface mount component nearby but cant recall if I got any on it.

 

I assume since system seems to boot/stress test fine that I am worrying unnecessarily ? and that if thermal paste had gotten some place it should not I would know about it via some serious issues with system ?

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Most thermal paste (except liquid metal and some other exotic stuff) is nonconductive, and will not harm your parts in any way.

English is not my first language, so please excuse any confusion or misunderstandings on my end, also I like to edit my posts a lot.

 

F@H-Stats

The Rigs:

Xenon:

CPU: 2x Xeon E5 2690 V3

RAM: 64GB DDR4 2133 RDIMM

MoBo: Supermicro X10DRi-T4+

Hydroxide:

CPU: Ryzen 5 5600

GPU: RTX 3080 12GB

RAM: 48GB DDR4 3200 UDIMM

MoBo: ASRock B550M Pro4

 

The Laptop (Lenovo Legion 5 15IAH7):

CPU: Core i5 12500H

RAM: 16GB (2x8GB) DDR5-4800

GPU: RTX 3050 Ti mobile

OS: Windows 11 Home

 

The Tablet:

Dell Latitude 7212 Rugged Extreme Tablet (Core i5 8350U/8GB RAM)

OS: Windows 11 Pro

 

 

.- -- --- --. ..- ...

 

 

 

🧀 

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19 minutes ago, mfny said:

Hi,

 

So yesterday I did a build, and everything assembly wise seemed to go ok as I have a working system as far as I can tell. However during the thermal paste application I am not certain if all the paste went where it should go, when i was spreading the paste over the IHS some I recall got down the side of it, along the little PCB "rim", I noticed there was a surface mount component nearby but cant recall if I got any on it.

 

I assume since system seems to boot/stress test fine that I am worrying unnecessarily ? and that if thermal paste had gotten some place it should not I would know about it via some serious issues with system ?

Do you know the name of particular thermopaste you used?

 

If you used something came with box/cooler then you don't need to worry about spilling. Most modern day thermopaste are none-conductive and non-capacitive. So they do nothing. 

 

Now if it got in the socket then you might have poor contact.

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2 hours ago, Supersonicwolfe said:

Do you know the name of particular thermopaste you used?

 

If you used something came with box/cooler then you don't need to worry about spilling. Most modern day thermopaste are none-conductive and non-capacitive. So they do nothing. 

 

Now if it got in the socket then you might have poor contact.

None got into the socket as the CPU was fitted in the socket. it was just down the side of the IHS and a little on the little rim of PCB around the base of the CPU as i was spreading the paste.

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7 minutes ago, mfny said:

I assume that no thermal paste could get under the CPU into the socket with CPU fitted and the retention arm locked ?

I think there have even be tests with such extreme conditions and still the system should work with no problems.

Modern systems are quite fool-proof.

Preferably the socket should not be filled with thermal paste, and it's recommended to clean the socket if any thermal paste is smeared there, the system should still work without problems.

 

To avoid smearing/overspill there are some plastic sheets: https://www.amazon.co.uk/dp/B0BGS66D17?crid=191ZC6RLBFPEB&keywords=noctua+na-stpg1&sprefix=noctua+na-stpg1,aps,272&ref_=as_li_ss_tl&language=en_US&sr=8-2&linkCode=gs2&linkId=38c2e358e8306dcbb3207d2f14d0867f&tag=enemyboatspot-21

 

And the AM5 secure frame, that is really not necessary should manage spillage too - https://www.amazon.com/Thermalright-Contact-Anti-Bending-Buckle-Secure/dp/B0BKZM72Z8?th=1

Pax vobiscum

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I am just wondering if its even possible for thermal paste to get under the CPU into the socket if it has made its way to the sides of the IHS with the CPU in place.

30 minutes ago, Tan3l6 said:

I think there have even be tests with such extreme conditions and still the system should work with no problems.

Modern systems are quite fool-proof.

Preferably the socket should not be filled with thermal paste, and it's recommended to clean the socket if any thermal paste is smeared there, the system should still work without problems.

 

To avoid smearing/overspill there are some plastic sheets: https://www.amazon.co.uk/dp/B0BGS66D17?crid=191ZC6RLBFPEB&keywords=noctua+na-stpg1&sprefix=noctua+na-stpg1,aps,272&ref_=as_li_ss_tl&language=en_US&sr=8-2&linkCode=gs2&linkId=38c2e358e8306dcbb3207d2f14d0867f&tag=enemyboatspot-21

 

And the AM5 secure frame, that is really not necessary should manage spillage too - https://www.amazon.com/Thermalright-Contact-Anti-Bending-Buckle-Secure/dp/B0BKZM72Z8?th=1

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1 minute ago, mfny said:

I am just wondering if its even possible for thermal paste to get under the CPU into the socket if it has made its way to the sides of the IHS with the CPU in place.

It is very unlikely situation, yet not impossible if using exorbitant amount of paste.

Pax vobiscum

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Some clarification since I think it did seem not obvious from my OP:

 

The paste was not squeezed out the sides on fitting the cooler, Some got on the side on the sides of the IHS and the PCB rim before fitting the cooler at all, during the spreading of the paste with spatula. Also I did not use enough paste that i could see notable amounts squeeze out the sides when i placed the cooler on the CPU

 

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6 hours ago, mfny said:

I am just wondering if its even possible for thermal paste to get under the CPU into the socket if it has made its way to the sides of the IHS with the CPU in place.

Not likely because most people mount them in a case, so the socket is perpendicular to the ground.

And most paste is really not that flow-y it will just harden over time on the side of the IHS.

 

4 hours ago, mfny said:

Some clarification since I think it did seem not obvious from my OP:

 

The paste was not squeezed out the sides on fitting the cooler, Some got on the side on the sides of the IHS and the PCB rim before fitting the cooler at all, during the spreading of the paste with spatula. Also I did not use enough paste that i could see notable amounts squeeze out the sides when i placed the cooler on the CPU

 

Yeah don't worry about it, just remember get enough wipes when you change paste/cooler/CPU next year.(Recommended to change paste every year, but if you don't see performance decrease then you don't need to change it. I don't change mine every year)

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