AMD backplate.

[Macer]

Budget (including currency): Already built

Country: Ireland

Games, programs or workloads that it will be used for: Gaming

Other details

This is a silly one,

I've installed a new CPU AIO in my sons PC. I replaced the AIO with the MB in the case and due to difficulties with the AMD backplate I reversed the white sticker on the plate to hold it in place while I screwed it in.

Would having the sticker stuck on the MB be an issue? 

I assume its OK as there is no heat generated on the back of the MB but I'm questioning this decision. 

[Godlygamer23]

I doubt it. I think it's fine.

[Bismut]

31 minutes ago, Macer said:

I assume its OK as there is no heat generated on the back of the MB but I'm questioning this decision. 

Not generated, but passed through for sure. I would assume it to be fine, but you might have some burnt-in glue after a while.

[Godlygamer23]

1 minute ago, Bismut said:

Not generated, but passed through for sure. I would assume it to be fine, but you might have some burnt-in glue after a while.

Assuming the glue gets hot enough to actually burn.

[Godlygamer23]

38 minutes ago, Macer said:

I assume its OK as there is no heat generated on the back of the MB but I'm questioning this decision. 

I'd also like to make comments about this directly...

Heat is not generated on the backside of the motherboard, but components do use it as a sort of heatsink, so those areas can get pretty hot. However, it won't pose any issues to the glue. Worst case scenario, it burns(I doubt that) and you have to scrape it off later on, or it makes removing the backplate more difficult. 

 

I would be mindful of adding any material that wasn't part of the original design in the first place. Make sure that it can actually withstand the heat being passed through from the components on the other side. 

 

Some of the components that come to mind would be MOSFETs and graphics memory chips...MOSFETs do sink a lot of their heat into the board, and memory chips use a flip-chip design, where the chip is on the other side of the package, closest to the physical board.

[Bismut]

16 hours ago, Godlygamer23 said:

Assuming the glue gets hot enough to actually burn.

"burn" might have been the wrong word, "baked" might be more fitting. Not so much an issue if it is baked to the backplate (because who cares about that, really?) but schmoo being on the back of the board could be less great, although not really something to worry about.

 

16 hours ago, Godlygamer23 said:

I'd also like to make comments about this directly...

Heat is not generated on the backside of the motherboard, but components do use it as a sort of heatsink, so those areas can get pretty hot. However, it won't pose any issues to the glue. Worst case scenario, it burns(I doubt that) and you have to scrape it off later on, or it makes removing the backplate more difficult. 

 

I would be mindful of adding any material that wasn't part of the original design in the first place. Make sure that it can actually withstand the heat being passed through from the components on the other side. 

 

Some of the components that come to mind would be MOSFETs and graphics memory chips...MOSFETs do sink a lot of their heat into the board, and memory chips use a flip-chip design, where the chip is on the other side of the package, closest to the physical board.

Basically what I wanted to say, just with less "why lot word when few word work" mentality.