We CAMM do this

[porina]

Splitting off from:

 

 

37 minutes ago, starsmine said:

Also, not topic relevent, notice the power band, We moving to CAMM baby, Dell standard is real. 

I found what seems to be the original slide to check out the footnote. The comment on POR implies just because it is listed on the slide it doesn't mean it will necessarily become a product in that way. Basically there may be differences or not happen at all.

 

Checking up on CAMM it looks like it was agreed by the industry through JEDEC. To me there are two very interesting implications: we can have replaceable LPDDR which has traditionally been soldered, so we can have capacity upgrade potential without having to decide up front. Also historically LPDDR often had higher speed than the equivalent standard DDR of the time.

 

 

[starsmine]

I imagine Camm on average will get more speed than DDR at the same price with better/easier motherboard and stick tracing for the timing, just like LPDDR

Camm2 is not actually the Dell standard apperently, its a revision of it, its went back to one channel per stick, Dell's Camm1 had both on one stick which makes things simpler, but less modular.

With camm, I wonder if it will disincentivize soldering as well, as you get the gains of soldering memory, without the lock-in. 

[starsmine]

1 minute ago, HenrySalayne said:

I doubt it. The contact springs are more expensive than directly soldering it down, the design has to accomodate the exact size and shape of the modules and the profit margin on RAM upgrades cannot be extorted.

 

I do hope customer decision towards CAMM pushes the scale in the right direction.

The modularity gives manufacturers a lot though. Sodims generally are only DDR. 

LPDDR is not modular at all, but the power savings and speed increase are worth the trade-offs for mobile uses.   
Like LPDDR5 is 6400MT/s at 1.05V, find a stick of DDR5 that can do that. 
and LPDDR5x can do 8533 MT/s at the same voltage, or Samsung says the same speed but 20% less wattage. 
CAMM lets it be modular without losing the power and speed. 

The best binned DDR5 sticks need at least 1.1v

remember power is V^2, the best-binned DDR5 6400MT/s stick that costs a hell of a lot more than a generic LPDDR5 chip and uses 10% more watts. (assuming resistance is the same... that's a big assumption I'll grant you)

modularity isn't just for the customer, it reduces SKU counts on their end as well as makes repairability cheaper for service calls. 

Memory routing on boards is some of the most complicated and time-consuming parts of motherboard design, the routing... just that, takes ~2 months per sku apparently, and with higher speed memory, its gotten more complicated (but computer tools have gotten better to help)

I dont think its going to eliminate soldered lpddr, there is no need to have it be modular on phones, and apple with their very small amount of laptops probably dont care. but companies like HP/asus/dell with there 100s of skus per generation will care a lot. 

[porina]

My guess: CAMM could replace SODIMMs where they are currently used. Smaller form factors will remain soldered.