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Direct die cooling

Letgomyleghoe
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Is it possible to direct die cool a ryzen 9 3900x? 

AMD blackout rig

 

cpu: ryzen 5 3600 @4.4ghz @1.35v

gpu: rx5700xt 2200mhz

ram: vengeance lpx c15 3200mhz

mobo: gigabyte b550 auros pro 

psu: cooler master mwe 650w

case: masterbox mbx520

fans:Noctua industrial 3000rpm x6

 

 

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They're soldered so uh.... not very easily or safely. 

Also why? They already have pretty damn good thermals. 

Gaming PC NAS Laptop Workstation

CPU: i5 12600KF 6P+4E Ryzen 7 3700X M4 SoC 4P+6E Xeon X5690 6c12t

Cooler: Noctua NH-D15S Wraith Stealth w/NF-A9 Passive Apple CPU Cooler

Motherboard: ASRock Z690 ITX/ax ASUS Pro B550M-C/CSM Apple J713AP Mac-F221BEC8 (Mac Pro 5,1)

RAM: 2x16GB 3600Mhz DDR4 2x16GB 2400MHz DDR4 24GB Micron LPDDR5 4x8GB 1333MHz ECC DDR3

GPU: Sapphire Pulse Radeon 9060 XT 16GB Radeon WX2100 M4 SoC 10C Radeon RX 5700

Storage: 1TB MP34 + 2TB P41 500GB SSD + 2x4TB IronWolf Pro in ZFS Mirror Apple AP0512Z 1TB Crucial MX500

ODD: LG WH14NS40 None LG GP65NB60 USB DVD Writer Don't know

PSU: EVGA 850W GM Silverstone SST-TX300 53.8Wh LiPo Battery Delta DPS-980BB

Case: Silverstone Sugo 14 Dell Inspiron 530S Mac16,12 chassis (13" MBA) 2009-2012 Mac Pro "Cheese Grater"

OS: Gentoo Linux TrueNAS Scale macOS 26 Tahoe Fedora Linux

 

Display: LG 27UK650-W (4K 60Hz IPS panel)

Mouse: EVGA X17

Keyboard: Corsair K55 RGB

 

Mobile/Work Devices: 14" M5P MacBook Pro (work) - iPhone 17 Pro - Apple Watch S11

 

Other Misc Devices: iPod Video (Gen 5.5E, iFlash Solo w/128GB SD Card, Rockbox), Nintendo Switch

 

Vehicles: 2002 Ford F150, 2003 Harley-Davidson Sportster 1200, 2022 Kawasaki KLR650, 1994 DR350SE

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It can be done but probably isn't worth it.  Probably best thing you can do is sand down IHS and the cooler mount to match perfectly flat, use Liquid Metal between them.  There is this though if you really want to try to go for it, not sure where or if anybody has or will make parts for Zen 2 desktop direct die cooling. 
 

*edit*

Older video touching on Zen 2 specifically with R5 3600, instead of similar but more demanding TR3 architecture.  I believe his conclusion was delidding wasn't worth it overall for AM4 with LM from die to IHS, but this didn't touch on potential direct-die applications

 

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