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Is there a larger chip on the other side that's different to the two NAND modules on the left in the picture? If there isn't, this is the SSD's controller. If there is, this is DRAM (i.e. DDR3). It's fine to apply some pressure to it in both cases, but tbh what gets really hot is the controller, not so much the rest of it

CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: HP EX920 1TB PCIe x4 M.2 SSD + Crucial MX500 1TB 2.5" SATA SSD, 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally, 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172) left outside Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

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2 minutes ago, Jurrunio said:

Is there a larger chip on the other side that's different to the two NAND modules on the left in the picture? If there isn't, this is the SSD's controller. If there is, this is DRAM (i.e. DDR3). It's fine to apply some pressure to it in both cases, but tbh what gets really hot is the controller, not so much the rest of it

Sorry I don't want to take the WD label off but this is what I see

ssd part 3.JPG

ssd part2.JPG

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6 minutes ago, natsuu said:

Sorry I don't want to take the WD label off but this is what I see

ssd part 3.JPG

ssd part2.JPG

it's fine, the label is soft and meant to fit surfaces that are not smooth

CPU: i7-2600K 4751MHz 1.44V (software) --> 1.47V at the back of the socket Motherboard: Asrock Z77 Extreme4 (BCLK: 103.3MHz) CPU Cooler: Noctua NH-D15 RAM: Adata XPG 2x8GB DDR3 (XMP: 2133MHz 10-11-11-30 CR2, custom: 2203MHz 10-11-10-26 CR1 tRFC:230 tREFI:14000) GPU: Asus GTX 1070 Dual (Super Jetstream vbios, +70(2025-2088MHz)/+400(8.8Gbps)) SSD: Samsung 840 Pro 256GB (main boot drive), Transcend SSD370 128GB PSU: Seasonic X-660 80+ Gold Case: Antec P110 Silent, 5 intakes 1 exhaust Monitor: AOC G2460PF 1080p 144Hz (150Hz max w/ DP, 121Hz max w/ HDMI) TN panel Keyboard: Logitech G610 Orion (Cherry MX Blue) with SteelSeries Apex M260 keycaps Mouse: BenQ Zowie FK1

 

Model: HP Omen 17 17-an110ca CPU: i7-8750H (0.125V core & cache, 50mV SA undervolt) GPU: GTX 1060 6GB Mobile (+80/+450, 1650MHz~1750MHz 0.78V~0.85V) RAM: 8+8GB DDR4-2400 18-17-17-39 2T Storage: HP EX920 1TB PCIe x4 M.2 SSD + Crucial MX500 1TB 2.5" SATA SSD, 128GB Toshiba PCIe x2 M.2 SSD (KBG30ZMV128G) gone cooking externally, 1TB Seagate 7200RPM 2.5" HDD (ST1000LM049-2GH172) left outside Monitor: 1080p 126Hz IPS G-sync

 

Desktop benching:

Cinebench R15 Single thread:168 Multi-thread: 833 

SuperPi (v1.5 from Techpowerup, PI value output) 16K: 0.100s 1M: 8.255s 32M: 7m 45.93s

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7 minutes ago, NewMaxx said:

The small little metal package is the PMIC (power management integrated circuit). There must be four NAND packages at 4TB - 16DP (16 die packages) at 512Gb/64GiB BiCS3 with 64 dies required.

is it a problem if a rubber thing slightly pushes against that area?

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14 hours ago, natsuu said:

is it a problem if a rubber thing slightly pushes against that area?

At U36? That's next to the three capacitors, related to DC-DC conversion. You don't want shearing (lateral) pressure on this but there should be no issue of electrical conductivity.

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2 minutes ago, NewMaxx said:

At U36? That's next to the three resistors, related to DC-DC conversion. You don't want shearing (lateral) pressure on this but there should be no issue of electrical conductivity.

its like a rectangular piece of rubber that pushes on that whole red part I circled, I think its a equivalent pressures of using your finger to lightly push something down. if that even makes sense lol. Sorry Idk how else to describe it

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I mean, it's possible to get data back, but not inexpensively or without knowhow and tools. You don't want to be breaking components off. Sometimes you can get by without one but that isn't the case here...but I mean it is tough and soldered. You just want to avoid electrical conduction (not an issue in this case I believe) and shearing/lateral (sideways or twisting) movement. These drives are often subject to vertical pressure from thermal padding and such.

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