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1van

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Everything posted by 1van

  1. https://linustechtips.com/main/topic/1123041-i-am-so-confused-on-my-ram/
  2. MSI Z370A is a risky board for 9900K 5GHz, especially when running AVX loads. It may be either/or CPU power limit or VRM throttling. Open your motherboard's manual and find where to change the CPU's short term and long term power limits, then do so. Keep an eye on the VRM temps when stress testing. You might need to put a small fan to cool it down. Watercooling only makes it worse for the VRM. Don't be afraid or lazy to use google/youtube. there are tons of 9900K OC guides available.
  3. I just have to link this guide in every topic related to LGA1151-1 What motherboard do you have?
  4. I see DRAM voltage is 1.2 V. Set it to 1.35 V manually. Set Vccio and Vccsa to about 1.15 V manually, too.
  5. It stands for Samsung, if it's not fake) they should work fine together. what board do you have? try installing the RAM in the slots 1 and 3, then remove and install in 2 and 4. If it fails, try reseating the CPU.
  6. Is it Samsung, or Hynix? You might want to tune some timings to see greater results. XMP tRFC and tREFI are usually quite slow.
  7. There is ver. #.## printed on each sticker, on the memory module itself. What does it say on each stick?
  8. Intel should have no problem running 4×8GB sticks, especially at such slow speeds. Have you tried to check each stick by installing just 1 at a time? What is written on each sticker? What version are they?
  9. Sorry, I just can't pass by without dropping this guide here By GA H270N do you mean GA-H270N-WIFI, a mini-ITX board? If so, it should be OK with something like i5-9400F or an i7-8700 non-K. The memory will clock up to 2666 MHz, too. Otherwise, Zen 2 is a solid option.
  10. It's an OK board, should be able to run a Coffee Lake i7 without any problems. Although a new i7 might be more expensive than R5 3600 + motherboard. This mod was experimental more than a year ago, not now.
  11. Most likely, these are not Samsung B-die. Anyway, the difference is mainly a heat spreader design. I have a suspicion that the new (Neo) kits might be more precisely binned, than the old stock, but it depends mostly on the manufacturing date, not the name. "Precisely binned" as in "lower chance to overclock higher than the XMP".
  12. What LGA1151 motherboard do you have? This can be interesting instead of switching to Ryzen
  13. Do you know for sure that the 7600K is not faulty? It should work with the F22 BIOS that you have. Does the board work with i5-6500 after the update?
  14. What motherboard do you have? If you are OK with a bit of modding, this is a great idea.
  15. Threadripper is not for gaming, especially the 1st gen, don't hesitate to do some google/youtube search)
  16. He's getting a 3700X, it scales well to 3600/3733 MHz, and even 3800 if he is lucky. You could get a 4000 MHz Viper Steel or a Teamgroup kit, and run it at 3600-3800 tight timings. If you just want to run an XMP profile, I'd still go with 3733 Viper Steel, even though it looks ugly
  17. Redundant cores on a 4C/4T CPU, are you serious?
  18. Option 1!!! You have the MB and memory already, 9400F is cheap (won't become much cheaper I think) and is OK for the 1660Ti. Option 2 will only get cheaper, it is reasonable to wait.
  19. I have both an 8700K and a 9700K, the 9700K is somewhat faster overall, even at 100-200 MHz lower clocks. If you don't plan to delid, 9700K is a better option. However, 8700K is easier to delid To make it clear, 9700K is a better choice than a non-delidded 8700K.
  20. https://pcpartpicker.com/products/compare/gLGxFT,3BCD4D/ They come in 3 colors, but make sure it has AES in the part number, it's Micron E-die, which is great for Ryzen, both stock and OC. And cheap)
  21. The problem is not with the stock thermal compound. Many aftermarket compounds get very stiff when cold. As several people replied already, you should have removed the heatsink when it is warm (a short stress test would do), and not by pulling up, but by twisting/sliding first. It's always easy to blame hardware for your own mistakes.
  22. 3200 CL16 kits are "lootbox bin" - can be made of any memory ICs currently in the market: Hynix, Micron, and Samsung, and the chips have different secondary and tertiary timings, if you'll mix such kits, you'll have to set it manually according to a weaker kit. Btw, Corsair shows which chips they use by the ver. x.xx on the memory sticker, just make sure that your kits will have the same ver. and it'll be fine.
  23. yeah, mixup 2 sticks of Samsung and 2 sticks of Micron and tell us how it goes, or how well it overclocks?
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