Had an idea, how about instead of using thermal paste to fill the air gap between the CPU IHS and Cooler Pad , we instead use slots on both IHS and Cooler Pad and sort of wedge them together before installing the cpu on the mother board socket. This would ensure zero gap between IHS and Cooler Pad and hopefully increase in thermal performance. IDK if anyone has tried this yet. I would love if Linus tries it out as an experiment and compare the results with stock Cooler with thermal paste.
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