Oh my god... I don't want to see Linus deliding CPU ever again...
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I am not even bothered by him not using LM as it has its own risks (at the cost of no maintenance though).
But the way he used the paste... blob in the middle on the CPU and then thick uneven spread on the another CPU die.
The first case leads to CPU failure quickly if the die doesn't get covered entirely, the other one just leads to way worse than ideal after-delid temperatures.
- DJ46 and PCGuy_5960
- 2