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Hello. I'm currently trying to do a peltier-water all in one cooling with pwm control to avoid condensation. I'm studying mechanical engineering and I want to do this as a project..

However I'm bit stuck right at the beginning of the calculations... Any engineers who have experience with peltiers? I know that they act as heat pumps, transferring heat from cold to hot side when you run some electric power into them... Am I just imagining that it can make the cooling more efficient? 

 

Theoretically speaking, if I overclock the CPU, put a peltier element on top of it and try to pump away the heat, the watercooling will still be my bottleneck and will still transfer the same amount of heat it normally would ... It would just make the peltier element warmer and that's it right? 

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In that case option to make the water cooling more efficient is to pump out the heat to a bigger surface and make custom block to increase the area from which the water will take away the heat.... Any engineers who could give me some feedback on this? :)

Thank you

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Well in terms of electric power consumption peltiers are ineficient... in terms of actual cooling when you get to OC temps when your CPU start's to thermal throttle, it can and will bring down the temps... I'm trying to show a proof that with this you will increase the efficiency of cooling... this means that since you are not limited to the actual size of the processor you can make better water flow through the water cooling element... it comes at a price of increased cost of the water block and  higher power bill

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2 hours ago, fRiend0 said:

Well in terms of electric power consumption peltiers are ineficient... in terms of actual cooling when you get to OC temps when your CPU start's to thermal throttle, it can and will bring down the temps... I'm trying to show a proof that with this you will increase the efficiency of cooling... this means that since you are not limited to the actual size of the processor you can make better water flow through the water cooling element... it comes at a price of increased cost of the water block and  higher power bill

What cpu are you going to cool? 

Rig Specs:

AMD Threadripper 5990WX@4.8Ghz

Asus Zenith III Extreme

Asrock OC Formula 7970XTX Quadfire

G.Skill Ripheartout X OC 7000Mhz C28 DDR5 4X16GB  

Super Flower Power Leadex 2000W Psu's X2

Harrynowl's 775/771 OC and mod guide: http://linustechtips.com/main/topic/232325-lga775-core2duo-core2quad-overclocking-guide/ http://linustechtips.com/main/topic/365998-mod-lga771-to-lga775-cpu-modification-tutorial/

ProKoN haswell/DC OC guide: http://linustechtips.com/main/topic/41234-intel-haswell-4670k-4770k-overclocking-guide/

 

"desperate for just a bit more money to watercool, the titan x would be thankful" Carter -2016

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Here you go, I hope you enjoy calculation,

 

You just need to find heat transfer rates for some materials, their thicknesses (or estimates) and surface area size. 

 

I just leave the famous 2600k here and some TDP graphs:

daciI.png

graph 1: shamelessly taken from http://electronics.stackexchange.com/questions/122050/what-limits-cpu-speed

So lets say you go for 5GHz then CPU needs modest 270W cooling power alone.

Lets say you use 200W Peltier element so total you have to transfer to waterblock is whopping 470W. On otherside because you can think peltier as "Heat pump" like you said then on CPU surface is only 70W of power that needs to be still passed trough peltier to waterblock. Basically you just move 400W on peltier hot surface and 70W to CPU surface (might be thinking it wrong atm, haven't done ever peltier heat transfer calculations).

 

Basically you then calculate every heat resistant material separately (those R's in my graph). Then at very end you end up with just

"Ts = CPU's Temperature surface"

Ts = q1 * Rtot + Tair , where q1 is your CPU die's heat what needs to be dissipated trough whole system. 

Ts = 70W * Rtot + 21C => yours cpu surface temp.

And what kind heat would be going into your water then? You simply adjust to Ts point to water and calculate it to

 

Twater = (q1+q2) * Rtot + Tair,

 

where q1 is cpu's die's heat what needs to be dissipated to water and q2 is peltier element's heat that needs to be dissipated to water. You might even get boiling temperatures if you do not have enough rads. NOTE! Rtot is different from previous calculation because materials have moved around in parallel heat transfer plan. 

 

Calculating Rtot = ( 1 / Rupper area sum +  1 / Rlower resistances sum )-1

 

To calculate Rdie you use formula: Heat resistance = Thickness / (Heat transfer rate * Area) Thus you get
Rdie = Ldie / ( Kdie * Adie ) ,                  { [m] / ( [W] / ( [m][K] ) * [m2] ) } = { [K] / [W] }

example: I assume 2600k's K is 90 W/mK, Die's thickness is 5mm and surface area is 291mm2

 

Rdie =  0,0005m / (90W/mK *  0.000291m2) = 0.01909 K / W

 

For convection

RFC = 1 / ( 100W/m2K *  Rad surface area 90 degrees towards forced convection )

Rad surface area = 0.24m * (1180 fins/m) * 0.025m/fins * 0.12m/12
                                 ^length,    ^fpi converted,  ^rad thickness,  ^rad witdh / how many fin rows

 

Twater = (70W+400W) * Rtot + Tair,

  • For CU: 390W / mk {Watts / meterKelvin}
  • For FR4: 0.3W / mK
  • For Forced Convection: 200W/m2K {Watts / SquaremeterKelvin}
  • For Natural Convection: 10W/m2K

dymanic_heat_transfer_calculation_for_cpu_tec_cooler.png

 

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4 hours ago, fRiend0 said:

Am I just imagining that it can make the cooling more efficient? 

 

Theoretically speaking, if I overclock the CPU, put a peltier element on top of it and try to pump away the heat, the watercooling will still be my bottleneck and will still transfer the same amount of heat it normally would ... It would just make the peltier element warmer and that's it right? 

It's much less efficient, but you can hit sub-ambient temperatures with it.

 

Let's say you have a 125W CPU, and a 75W peltier element.

 

If you just put the heatsink/water block directly on the CPU, you are just moving the heat out of the CPU.  If you just put a heatsink/water block directly on the hot side of a peltier, and don't put anything on the cold side, you're just moving the heat from the cold side (which will frost over) to the hot side.

 

Cooling a CPU with a peltier requires moving the heat from the CPU (125W) , as well as the heat contributed by the peltier itself (75W), so your cooling system must be able to handle the combined 200W cooling load.

SFF-ish:  Ryzen 5 1600X, Asrock AB350M Pro4, 16GB Corsair LPX 3200, Sapphire R9 Fury Nitro -75mV, 512gb Plextor Nvme m.2, 512gb Sandisk SATA m.2, Cryorig H7, stuffed into an Inwin 301 with rgb front panel mod.  LG27UD58.

 

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