Melodist

What's power limit deactivating MCE on an Asus motherboard on an Intel 14900K? 125 PL1, 253 PL2 and 500 A? I'd like to use 253 on PL1 and PL2 with 307 A. When simply deactivating MCE, my CPU drew 253 Watts which means at least PL2 is set to 253 Watts and probably 500 A since at 307 A, it would not consume more than 225 Watts. So what are now the actual Powerlimits when disabling MCE on Asus?? Also so consequently, what should I do to use the PL1 253 Watts and PL2 253 Watts 307 Amps power limit? 1: Disable MCE, Set PL1/PL2 to 253 Watts and 307 AMPs. 2: Keep MCE on Auto, Set PL1/PL2 to 253 Watts and 307 Amps. 3: Disable MCE, don't touch PL1/2 and set current limit to 307 amps (however I don't know what PL1 and 2 are when disabling MCE)? Anyone can help me?

You mean push down the ILM and mount the CPU? I didn't want to do it since it's not recommended to clamp down the CPU into the socket without the board being supported by the standoffs.

I didn't want to keep rubbing off the contact solder since I already re-seated it twice but I guess I can do that. But the CPU I can leave in like this right?

Is it ok to leave my unmounted CPU and unscrewed motherboard in case overnight? To keep it from dust. It's been installed beforehand but I didn't like the case and cooler and gonna get tomorrow a new one. I removed the cooler, cleaned the IHS but haven't tightened it down yet and also removed the screws that secure the motherboard to the standoffs. Can I leave it like that in my case till tomorrow? Also, the motherboard has a slight warp upwards on the right side at the ram, would that get worse overnight if I don't screw it down? Or is it ok? Warp might come from the first time of clamping down the ILM?

Didn't like how the doors interacted with the front of the Meshify 2, very rattly and getting stuck a little, doesn't happen with the Define 7 C.

Should I go for a Fractal Define 7 Compact with open front versus the Torrent Compact for a 14900K workstation build? The Torrent Compact seems to have a great out of the box airflow but I'm a bit concerned about the quality of the case (not much material holding the case together, plastic top, crammed cable space? and no bottom for a GPU bracket. The Define 7 Compact seems to be great quality all around, just the front panel is an issue. Couldn't I just remove it and run it open or mod it? What do you think I should pick?

Are contact frames 100% reliable when it comes to running a professional setup? Or are there any inherent possible Instabilities when using a contact frame regarding the lack of pressure the Intel ILM does? Also, why does it say stable in green on Igorlab testing for the ILM and stable / retraining on the Contact Frame? Doesn't Ram always retrain when put into a system?

Hello there, thinking about getting a pair of 64 GB Corsair Vengeance RAM. Deciding between 6400 CL32 vs 6800 CL32. Is it worth getting the 6800 at this lower latency? System will be Intel 14th Gen.

I actually re-checked and there doesn't seem to be any plastic-alike insulation / padding like the ILM and Thermalright Contact Frame has. Which if that's the case and my eyes and fingers aren't playing tricks on me, then the Thermalright frame is superior at a much lower price and puts the hole german engineering thing highly into question, which is quite upsetting, since I'm German too.

Man it's thoroughly confusing the more you read about it. 1: Intel says it's fine and warns everybody using it, running the CPU out of spec. 2: on the other hand the bend looks really bad and having a frame would seem a lot better to run it for the next 5+ years 3: possible incompatibilities with the board and ram 4: possible incompatibilities with the cooler I guess I'm more concerned about the CPU's higher height interacting with a cooler that is used to a lower height pushing the CPU down again and creating unknown stress to the CPU. I don't think that's been tested well enough with Air Coolers in mind.

That's exactly what I thought, I however would like to know how Noctua feels about using contact Frames with their spring system and pre-calibrated distance to the IHS based on the ILM.

I also wonder though how coolers such as Noctuas which have a specific mounting pressure and convex shape affect the contact Frames' compatibility and whether that might harm the CPU's integrity as well. It's lots of variables I feel.

What's the exact reason for that? Not enough pressure on the IHS down to the pins? Since the stock ILM puts a lot of force on the CPU when clamping it down.

Just the thermal grizzly floating one or also the TR with the issue? Do you think I'd be fine without the frame? Running the system for the next 5 years reliably? Could the frame be installed at a later point in time or will it be too late when the CPU is bend?

I guess the 12th Gen chips had it the worst but based on Roman's laser measurement, 14th Gen still bends. It doesn't seem to be any rubber on the product pictures or am I missing it? Are these bottom out installations hassle free when it comes to stability and reliability? Just as stable as the ILM? 70% I do on my system will be professional post audio production and I need it to be 24/7 reliable. So you're saying I'd still be doing fine in 3 years from now using the ILM? I probably won't upgrade for the next 5+ years.