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About Subsonicq

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  1. Thanks, its a 32g kit. i think in the future at some point ill just buy two 16 kits as when i bought it i didnt know that 4 dimm kits werent the best. bit of a shame.
  2. This is true, i was in hope to maybe bump the frequency up a little and timing to match if it benchmarked better id keep it. i might try keeping at 1.35 and knocking frequency up and losser timing a tad. C-Die would explain why it crashes when you knock the volts up with no other changes. Keep the ideas coming.
  3. This is how i fell too, but the XMP profile does match the sticker so thats one thing right haha. if i put those timing in, im not even sure jumping the CMOS would get me out of trouble haha!
  4. its obviously simple but easily forgotten, have you jumped the CMOS pins and tried your overclock again? id jump the cmos and reseat ram again but im not overly optimistic. worth a try ?
  5. Ryzen master is telling you lies, so it seems. are you using the stock cooler? and are you using PBO ? (precession boost overdrive) Ryzen 3X series automatically have PB (precision boost, theres a difference) running all the time, PBO tells the motherboard its okay to send more TDC EDC and PPT volts and amps, this leads to more heat, and the amd temps bounce around normally, if you dont have a good cooling setup this could be both limiting your peak single core boosts and making excess heat. PBO is still something to be worked on by amd in my opinion as i noticed that my asus X570-F loves to send more core colt than is required to reach peak frequency and made unnecessary heat in the system. if you are not running a good cooling system and using the stock cooler i would recommend in the bios changing PBO to auto (usually stock for disabled) or disabled and see how your system runs then. you should only note a small performance drop say somewhere around 3 percent and much much lower CPU temps. i hope this helps.
  6. 16GB for gaming is 95% of the time more than enough, if you youtube some benchmark videos between 32 and 16 GB there is really no difference, 8 to 16GB there is a difference. Sometime for a reason i cannot explain is that i noticed in the benchmark videos 32gb ram situations slightly reduced CPU load. But as mentioned above if you need to sacrifice something for 32 i wouldn't. Personally i would choose better cooling or an NVME SSD over the 32 GB upgrade. however 32GB is heaps better if you are doing any photomanipulation, design work or video editing / rendering as i have noticed the programs park alot of what you are doing in the RAM until your done.
  7. Hi everyone, Ive been attempting to overclock the ram for whatever reason and not a single success, it may be that this kit just cant do it but lets try. The RAM: GSKILL TRIDENT Z NEO / see bellow for Thaipoon data. CPU: Ryzen 3700x overclocked to 4.4ghz @ 1.285v SOC 1.1v MOBO: Asus ROG STRIX X570-F So the ram loads the DOCP profile fine, DOCP or JEDEC profile if you push voltage passed 1.35v even up to 1.5v the system will post but windows BSODS with hardware crash is what the code transalates to. I have altered the timings even just a little and it never passes memtest over a few hours, however JEDEC and DOCP pass no problem. I have bumped up the FLCK and Infinity fabric (FLCK /2) and it doesnt pass memtest over a few hours but loads fine. And heres an odd one, if i reset everything to do with RAM to auto .... it doesnt post, go figure. So, my thoughts are maybe that the sub timings that are always auto could be causing OC issues, RAM CALC for Ryzen doesnt help me one bit due to its touchy state, another could be the OHM settings ? really im not sure, i would like to give up but id rather come to understand why or what is causing the limit for interest sake, if i can get more out of the RAM thats great but if its not going to happen well its alright where it is then. Thanks everyone. MEMORY MODULE Manufacturer G.Skill Part Number F4-3600C18-8GTZN Serial Number Undefined JEDEC DIMM Label 8GB 1Rx8 PC4-2133-?A1-11 Architecture DDR4 SDRAM Undefined Speed Grade DDR4-2133 Capacity 8 GB (8 components) Organization 1024M x64 (1 rank) Register Manufacturer N/A Register Model N/A Manufacturing Date Undefined Manufacturing Location Taipei, Taiwan Revision / Raw Card 0000h / A1 DRAM COMPONENTS Manufacturer Samsung Part Number K4A8G085WB-BCPB Package Standard Monolithic 78-ball FBGA Die Density / Count 8 Gb B-die (Boltzmann / 20 nm) / 1 die Composition 1024Mb x8 (64Mb x8 x 16 banks) Input Clock Frequency 1067 MHz (0.938 ns) Minimum Timing Delays 15-15-15-36-50 Read Latencies Supported 16T, 15T, 14T, 13T, 12T, 11T, 10T Supply Voltage 1.20 V XMP Certified 1802 MHz / 18-22-22-42-64 / 1.35 V XMP Extreme Not programmed SPD Revision 1.1 XMP Revision 2.0 / December 2013