AdmiralFishHead

Well it's not a duplicate, it's basically a bridge based on the shape of the original heat sink, but the goal is to not provide cooling, but rather to channel the heat to a proper CPU cooler that will be attached to it. It's fairly easy to mill the surface to be smooth enough to provide good contact with the laptop's CPU, GPU and the addon CPU heatsink. The biggest question is whether the channeling capacity is there.

I have this insane project in mind where I convert my Y500 laptop into a gaming desktop (assuming I can build/find the Ultrabay to PCI-E adapter). However, the cooling on this laptop is complete trash. The CPU isn't even the most powerful for the socket but it already struggles getting to turbo frequencies without throttling down a notch. I started looking into making mods to the default heat sink rig, perhaps soldering a copper CPU cooler to it or soldering a custom made copper frame that can be used to install a proper CPU heatsink. But I feel like it won't be as good as making a completely new frame. In order to make a new frame, I can of course use aluminum or copper and mill them, but I feel like the costs of modeling and doing minor adjustments will quickly add up. Then I realized that I can use the currently used heat sink to create a mold to base the work on, then the mold could be used to smelt Tin into the proper shape. Tin is very cheap and easy to melt, yet I don't see it used a lot. Are there examples of Tin coolers and how well they perform? Heat conductivity of Tin is about the same as Copper, so I don't see what issues I could face.

Would running several copper wires from the CPU's heat spreader to the case work? I mean multi-core copper wires are really thin and they should conduct the temperature really well (theoretically) as they have high thermal conductivity and no thermal mass. I am not sure how easy it would be to solder a copper wire (or pipe) to the flat copper heat spreader and flat aluminum walls on the case.

Nope, the tank isn't completely sealed. The tank can be opened from above, and it has actively cooling components cycling the oil through a radiator to cool it down. The degradation of rubber parts is a valid point, however, it may be possible to replace the mineral oil with NOVEC liquid. The questions about pressurization issue inside the case still stand.

I think the closest video would be the one with Macbook being submerged into a tray with water. It is a closed system, but it's being cooled by water from the outside. This isn't quiet the same as my project involves having liquid inside the closed system. Other videos are just submerged system, unsealed and with active cooling cycling the liquid.

I am trying to plan ahead and reuse my old Lenovo Y500 laptop for something fun in a year when it becomes 10 years old and I replace it. I am leaning towards using it as a portable and silent rig, for playing older games (pre-DirectX 11) and maybe some research calculations. Naturally I stopped with submerged cooling setup, because it is quiet and effective at cooling (good heat transfer). It will also simplify installation, since you don't need parts made precisely for laptops and you can just plot your stuff into the tank and forget about it. I however want to be safe to move and headache free. I don't want to worry about it flipping over. So I figured a sealed solution would be the only choice.At first I thought about using a fish tank, or building one myself, but it won't be easy to move around as those types of projects aren't usually sealed. I am currently researching the feasibility of utilizing an aluminum case with built-in heatsink grills, in particular there is a large number of options offered for amplifier-building hobbyists. This is a great option size-wise, since my laptop motherboard is perhaps 30 cm by 30 cm and a sub $100 DIY amplifier case can fit it. I attached an example of such case to this post. In order to make it easy to move, I plan to seal off the openings with high melt hot glue (with melting point of over 150 C) after the motherboard and wiring is installed, before filling the case with mineral oil and sealing it off for good. The hardware includes a 90W laptop power supply stripped down, and a motherboard with the following configuration: i7-3630QM GT 650M 16Gb RAM mSata SSD My first concern is how effective a case like this would be in cooling laptop hardware sealed inside without any active cooling on the outside. Can a large aluminum mass with grills provide enough cooling? My second concern is how the air sealed inside (provided I will not fill the box with cooling liquid to the rim) is going to affect the case by expanding during high load. Is expanding air an issue in projects like this? What about expanding cooling liquid? Thoughts?