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jackBnimble

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About jackBnimble

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  1. I've decided to add USB 3.0 pcie expansion https://www.newegg.com/p/17Z-00PR-016E6 $20.70 5.25'' Bay Multifunction Card Reader https://www.newegg.com/p/376-00ET-00001 $28.99 5.25'' Bay lockable cabinet drawer https://www.newegg.com/navepoint-00300544-rack-mounted/p/2BA-001H-00053 $61.95 That brings my newegg shopping cart total to $1141.48. I think the build has great performance/value/quality per dollar and will be nice to have when i decide to replace my rx480. Does anyone have any final thoughts about the build? Thanks again!
  2. PCPartPicker Part List CPU: AMD Ryzen 5 3600 3.6 GHz 6-Core Processor ($173.99 @ Amazon) CPU Cooler: be quiet! Dark Rock Pro 4 50.5 CFM CPU Cooler ($89.90 @ Amazon) Motherboard: Asus TUF GAMING X570-PLUS (WI-FI) ATX AM4 Motherboard ($189.99 @ B&H) Memory: G.Skill Trident Z 16 GB (2 x 8 GB) DDR4-3600 CL15 Memory ($124.99 @ Newegg) Storage: Sabrent Rocket 4.0 1 TB M.2-2280 NVME Solid State Drive ($199.98 @ Amazon) Case: Cooler Master HAF XB EVO ATX Desktop Case ($109.99 @ B&H) Power Supply: Thermaltake Toughpower GF1 PE 850 W 80+ Gold Certified Fully Modular ATX Power Supply ($138.99 @ Amazon) Total: $1027.83 Prices include shipping, taxes, and discounts when available Generated by PCPartPicker 2020-08-08 11:25 EDT-0400
  3. PCPartPicker Part List CPU: AMD Ryzen 5 3600 3.6 GHz 6-Core Processor ($173.99 @ Amazon) CPU Cooler: be quiet! Dark Rock Pro 4 50.5 CFM CPU Cooler ($89.90 @ Amazon) Motherboard: Asus TUF GAMING X570-PLUS (WI-FI) ATX AM4 Motherboard ($189.99 @ B&H) Memory: Patriot Viper Steel 16 GB (2 x 8 GB) DDR4-4000 CL19 Memory ($99.99 @ Newegg) Storage: Sabrent Rocket 4.0 1 TB M.2-2280 NVME Solid State Drive ($199.98 @ Amazon) Case: Cooler Master HAF XB EVO ATX Desktop Case ($109.99 @ B&H) Power Supply: Thermaltake Toughpower GF1 PE 850 W 80+ Gold Certified Fully Modular ATX Power Supply ($139.99 @ B&H) Total: $1003.83 Prices include shipping, taxes, and discounts when available Generated by PCPartPicker 2020-08-08 09:34 EDT-0400 Great feedback fellas thanks. I've made some fine adjustments to the build thanks to your insight. I'll continue to look more into the issues as time allows and see what happens.
  4. Budget (including currency): $1100 Country: USA Games, programs or workloads that it will be used for: Casual Other details (existing parts lists, whether any peripherals are needed, what you're upgrading from, when you're going to buy, what resolution and refresh rate you want to play at, etc): https://pcpartpicker.com/list/Qnw2vW AMD Ryzen 5 3600 3.6 GHz 6-Core Processor Fractal Design Celsius S24 87.6 CFM Liquid CPU Cooler Asus TUF GAMING X570-PLUS (WI-FI) ATX AM4 Motherboard Patriot Viper Steel 16 GB (2 x 8 GB) DDR4-4000 CL19 Memory Intel 660p Series 1.02 TB M.2-2280 NVME Solid State Drive Cooler Master HAF XB EVO ATX Desktop Case Thermaltake Toughpower GF1 PE 850 W 80+ Gold Certified Fully Modular ATX Power Supply Microsoft Windows 10 Home OEM 64-bit $1061.71 This is to be a semi-portable media box. It will use a 480 gpu until rdna2 cards are available. Does anyone have any suggestions? I'm concerned about AIO quality and GPU clearance. How about an interesting 5.25'' accessory?
  5. I have no idea what the problem could be. You could try unplugging everything and cleaning the PC. Check the wires for integrity or what have you. Do you have a way of testing individual parts? Does the monitor work with another machine for instance? Turn the PSU switch to off before you try.
  6. Not sure how many moving parts a PSU has. Would be my bet the fan bearing is going bad? Try restricting the fan before you turn it on, or stop it when the sound is present.
  7. You would have to seal the case and probably reinforce it because the atmosphere will apply 14.7lb/in^2 or 2,116.8lb/ft^2.
  8. Thermal Contact Resistance Apologies, it's my me time. From Yungus and Cengel, "In the analysis of heat conduction through multilayer solids, we assumed “perfect contact” at the interface of two layers, and thus no temperature drop at the interface. This would be the case when the surfaces are perfectly smooth and they produce a perfect contact at each point. In reality, however, even flat surfaces that appear smooth to the eye turn out to be rather rough when examined under a microscope, as shown in Fig. 3–14, with numerous peaks and valleys. That is, a surface is microscopically rough no matter how smooth it appears to be." peaks...valleys... air gaps... act as insulation.... "and this resistance for a unit interface area is called the thermal contact resistance, R sub c." ...Determined experimentally...scatter of data... A quantity of heat is given in joules (Q). Heat flow in watts is dot Q. dot Q = dot Q sub contact + dot Q sub gap dot Q = (h sub c)A(delta T sub interface) "where A is the apparent interface area (which is the same as the cross-sectional area of the [thing]) and (delta T sub interface) is the effective temperature difference at the interface. " (h sub c) is the "thermal contact conductance" is W/(m^2*K) (R sub c) = 1/(h sub c) = (delta T sub interface)/(dot Q/A) ...That is, thermal contact resistance is the inverse of thermal contact conductance. ... depends on...surface roughness... material properties... temperature... pressure... "type of fluid trapped at the interface"... "Thermal contact resistance is observed to decrease with decreasing surface roughness and increasing interface pressure, as expected. " is it significant? " We can answer this question by comparing the magnitudes of the thermal resistances of the layers with typical values of thermal contact resistance. " where h is usually convection (w/(m^2*k)) k is conduction (w*m/m^2*k) consider 1cm of "insulation" [here] R sub { c insulation} = L/k = 0.01m/0.04(w/m*k) = 0.25 m^2*k/W and 1cm of "copper" R sub { c copper} = L/k = 0.01m/386(w/m*k) = 0.000026 m^2*k/W because dot Q = kA(delta T)/L a small L/k[A] means a big k[A]/L. coppers in their native uninterupted state are perfectly happy to conduct heat in whatever lattice structure copper happens to have. gaps full of air disrupt... insulate... "The thermal contact resistance can be minimized by applying a thermally conducting liquid called a thermal grease " ...commonly... electronic..." can also be reduced by replacing the air at the interface by a better conducting gas such as helium or hydrogen" The point for this post however is the next revelation: "Another way to minimize the contact resistance is to insert a soft metallic foil ... silver" ... "Experimental studies show that the thermal contact resistance can be reduced by a factor of up to 7 by a metallic foil at the interface. For maximum effectiveness, the foils must be very thin. The effect of metallic coatings on thermal contact conductance is shown in Fig. 3–16 for various metal surfaces. " "There is considerable uncertainty in the contact conductance data reported in the literature" Linus, if you're going to hacksaw a block of aluminum then do me a favor-- buy some silver leaf and coat a processor before you attach the heatsink; apply power, record the data, publish the results. Further, is the community aware of the kinds of machine finishes that processor caps and heatsink connectors are worked to? How much would someone pay to silver leaf a processor? How much would it cost to minimize surface tolerances? What's the range of benefits we could expect to see by minimizing air gaps in surface contacts? Do thermal compounds compare to silver leaf? What about thermal compound AND silver leaf?! Could a structurally sound chip support more pressure and more thermal contact? ISBN 978-0-07-339818-1
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