It's me!

Well, the listing does tell us that 1.) it will come with PCIe 3.0 and 2.) that it will not come with PCIe 4.0, which is a bummer.

What did Tom's call it? I think it is the 400 series. Seems odd to call the chips Pinnacle tho, isn't that the name of the new APUs?

Well well, so it begins. AMD has 400 Series motherboards listed on PCI-SIG Integrators list. Woot! I bet they stick with Socket 1331 too, so perhaps just a bios flash to move forward. One thing is for certain, whatever they have is coming soon! http://www.tomshardware.com/news/amd-400-series-chipset,36174.html

Well, I thought that AMD had grabbed a lot more share than this from Intel, but a lot of sites report garbage information. Still, adding nearly a million units in sales is pretty damn impressive. They also talk about how Ryzen doesn't compete against the whole market because of price and the lack of an IGP, which is a good point. the most important part is at the end of thee article they talk about how good Global Foundries 7nm is compared to Intel's 10nm. http://www.tomshardware.com/news/amd-ryzen-intel-desktop-pc-market-share,36152.html

Well, Intel['s pricing seems to have gone up A LOT, and they are segmenting even more by cutting out half the features, or more, on a lot of the Xeons. http://www.tomshardware.com/reviews/intel-xeon-platinum-8176-scalable-cpu,5120.html

It appears that Skylake's thermal and power problems aren't really coming from the motherboards, but instead,, the processor. The infrared videos really do a good job of showing where the heat is truly coming from. http://www.tomshardware.com/reviews/-intel-skylake-x-overclocking-thermal-issues,5117.html

perhaps 'de-listing' is a better term?

Oh. well I wasn't aware that they are pulling cards from shelves in the U.S.

Well, here's the deal. If they cant get them in Europe for three months then there is zero doubt, at least in my mind, that they will start pulling them from shelves in the US. They will start pulling them at smaller retailers first, but I imagine it's only a matter of time. http://www.tomshardware.com/news/ethereum-mining-german-graphics-shortage,34959.html

What do you need me to adjust? Im not sure why its doing that, but am happy to do what i can to help. The dark theme seems to have an issue with the text?

There's no doubt that AMD has margin problems, a big portion of the investment community dumped their stock due to the reduced margins. It's apparent that part of the problem stems from the unlocked multi's, though. AMD is slashing prices on high end models because everyone is jumping on the cheap models. http://www.tomshardware.com/news/amd-stock-slump-ryzen-cpu,34318.html

Well, they finally got their hands on Optane! Looks impressive Certainly the fastest, ever! http://www.tomshardware.com/reviews/intel-optane-3d-xpoint-p4800x,5030.html

Man, Toshiba just can't get it right. First, they had a huge accounting scandal, and now they are going to have to sell off their fabs after a SECOND scandal. http://www.tomshardware.com/news/toshiba-nuclear-chairman-loss-semiconductor-spin-off,33660.html

Yeah, this certainly isn't 1000X of anything.

Intel's 3D XPoint SSD specifications have leaked, and thankfully this time it isn't a caching device. They have memory and now an actual SSD coming to market, so we are finally seeing at least some sign that the company is on track. http://www.tomshardware.com/news/optane-3d-xpoint-intel-p4800x-cold-stream,33624.html

Crazy how politics go. Krzanich announces the new 7nm fab in the same room as Trump after public disagreements over immigration. Krzanich did mention immigration in his note to employees about the fab, though. http://www.tomshardware.com/news/intel-fab-42-7mn-chandler,33619.html

No, each individual die has 64 layers of cells, which means that it has 64GB of capacity per die. They take the die and then stack them up into a package. Each package can have up to 16 die, which means 1TB max.

Each die has 64 layers of cells. Then they stack those die into packages, so you could have up to 1 TB of NAND in a single package if they stack it up to 16.

I'm referring to its other 3D NAND. This is the third revision, but the first two aren't even really on the market.

This is like WD's third announcement of a new 3D NAND, but I can't find any of its previous 3D NAND in an SSD anywhere. I know the 48-layer is in the iPhone, but other than that there arent any SanDisk 3D NAND products out there. It certainly isn't in any SSDs. http://www.tomshardware.com/news/wd-toshiba-3d-nand-64-layer,33588.html

Intel surprisingly had enough of a mass die-off of CPUs that it has impacted its financials. Thats surprising, considering that Intel has a good reputation for reliability. http://www.tomshardware.com/news/intel-cpu-failure-atom-processor,33538.html

you must not've read it. He says it will create a glut, which the other suppliers wont like. They didnt really speak either for or against it.

It's not a false equivalence, it isnt about where the fabs are located -- they are owned and controlled by USA-based companies.

The problem is that it is a state-owned company, so it isn't fair competition. They are laying the groundwork to take over the industry, much like when the Chinese dumped steel on the US market under costs to kill competitors. Also, since it is state owned they wont have tarrifs, so they can undercut all US suppliers for in-country sales. Then, to top it off, as a state-owned company they will never be charged with patent infringement or other abuses, so its free reign to do...whatever.

China's rise in semiconductor tech is troubling. The US, and other countries, have been blocking their acquisitions of late, but they don't seem to care. http://www.tomshardware.com/news/nand-dram-fab-tsinghua,33470.html