Is this a good thermal paste application?

[Locutus494]

I've been taking apart my system to clean and troubleshoot it. After having to reapply thermal paste on my CPU a few times, I've noticed that the edges of the CPU or cooler seem to be at a larger gap than the middle. You can see in the picture how the paste seems to be squeezed to the sides leaving hardly any coverage in the middle. Is this a problem; is the surface of either my CPU or waterblock not quite flat?

[Slottr]

How are you applying it?

 

Rule of thumb is pea sized or large grain of rice

[Br3tt96]

Pea sized or rice, and let the cooler spread it. 

 

That's a bit too much, which with thermal paste.. Less is more

[Locutus494]

This is the first time I've actually put a CPU together, but pea-sized is exactly what I did. Weather or not that's too much paste, is there not an issue with the surface not being flat causing the waterblock to only touch in the middle?

[Lazaro]

yeah that's way to much, for a standard CPU just a small pea size in the middle is good. 

[Locutus494]

Again, all I did was a pea sized drop in the middle. The waterblock spread it out like that. I'm trying to find pictures of the 990X delidded to see how big the actual chip is under the IHS to see if the waterblock is making enough contact. My concern is the waterblock isn't making enough contact with the CPU to properly cool the whole thing.

[NumLock21]

Your water block is covering the entire CPU. Spread a thin layer on the CPU and then install your water block.

[Locutus494]

I checked both with a straight piece of metal. Both the waterblock and CPU are slightly convex, the waterblock more than the CPU. I guess I'll just have to see how the temps are once I get my replacement PSU (hopefully) this weekend and get my system back together. I wish I had paid attention more to how the paste was from the builder when I disassembled it.

[Arika]

Once you put it on, do not take it off to check the application and then put it back on, this can cause air bubbles to get trapped in the voids between the paste and air sucks at thermal conductivity.  put your pea on, throw on the block and tighten it and leave it.

 

you say your concerned about it not making sufficient contact, have you checked your temperatures?

[Locutus494]

Can't check my temperatures; the reason I took it apart in the first place is to troubleshoot the system. Turns out my PSU is bad; I haven't been able to turn it on since July 4th. I just ordered one today; it'll be a few days before I get it.

[For Science!]

11 hours ago, Locutus494 said:

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just to clarify on your original question, the fact that there is little-to-no paste on the middle is a good thing, you want metal-to-metal contact and the paste to only fill out the micro cracks. to me if you can mount at a higher pressure, that will be even better.

[Locutus494]

I hope you didn't take apart your PC just to show me that picture! That's dedication!