Delidding my 7700k, some questions

[Deadly Duck]

So after the delidding I see people use silicone to stick back down the heat spreader, is that needed? I figure the pressure from the CPU hold down clamp will keep it in place. Also I see some people apply liquid metal TIM to not only the die but also the underside of the heat spreader, is that really needed? I'd think that's more of a risk for using to much liquid metal and risking shorting something out.

[Speaker1264]

Neither is really necessary.  And if you don't want to risk shorting you can apply electrical tape over the capacitors under the IHS.

[Tiwaz]

you only need Liquid metal on the die, putting it on the HS will give you 2°C at best. If you applied Liquid metal i'd use high temp silicone glue because the HS could move a little when locking the retention arm in the socket, but if it works then you are fine, with proper application you should be gettin 10-20 °C less on your chip

[Tiwaz]

1 minute ago, Speaker1264 said:

Neither is really necessary.  And if you don't want to risk shorting you can apply electrical tape over the capacitors under the IHS.

or put electrically non conductive thermal paste on them

[Deadly Duck]

1 minute ago, Speaker1264 said:

Neither is really necessary.  And if you don't want to risk shorting you can apply electrical tape over the capacitors under the IHS.

What would the befits be of gluing it back down? I think you would want it to be easily removed in case you need to reapply 

[Deadly Duck]

1 minute ago, Tiwaz said:

you only need Liquid metal on the die, putting it on the HS will give you 2°C at best. If you applied Liquid metal i'd use high temp silicone glue because the HS could move a little when locking the retention arm in the socket, but if it works then you are fine, with proper application you should be gettin 10-20 °C less on your chip

So you think it's important to glue to back down, I really dont like the idea of it

[Speaker1264]

6 minutes ago, Deadly Duck said:

What would the befits be of gluing it back down? I think you would want it to be easily removed in case you need to reapply 

Dunno, I guess it's just easier to clamp it back into the socket maybe, or so that they can sell it used later without having to worry about the buyer making a claim that it is defective or something.  I personally wouldn't add the adhesive back, because it creates additional gap between the cpu and die and the IHS, which may negate some of the benefits of delidding.  You shouldn't be worried about having to reapply it later, though.  The liquid metal never goes bad from what I've seen.

[Tiwaz]

2 minutes ago, Deadly Duck said:

 

 

2 minutes ago, Deadly Duck said:

 

just a bit on the corners so you dont move hte HS when installing it back into the socket because you could lookse thermal contact to the die with some TIMs but if it works for you without then you're fine

[Deadly Duck]

3 minutes ago, Tiwaz said:

 

just a bit on the corners so you dont move hte HS when installing it back into the socket because you could lookse thermal contact to the die with some TIMs but if it works for you without then you're fine

OK, a dab in each corner sounds good to me

[TrigrH]

18 minutes ago, Deadly Duck said:

So after the delidding I see people use silicone to stick back down the heat spreader, is that needed? I figure the pressure from the CPU hold down clamp will keep it in place. Also I see some people apply liquid metal TIM to not only the die but also the underside of the heat spreader, is that really needed? I'd think that's more of a risk for using to much liquid metal and risking shorting something out.

generally you do both or do neither, since if you are using glue you would want the extra metal on the IHS.